JPS6411337A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6411337A JPS6411337A JP62167264A JP16726487A JPS6411337A JP S6411337 A JPS6411337 A JP S6411337A JP 62167264 A JP62167264 A JP 62167264A JP 16726487 A JP16726487 A JP 16726487A JP S6411337 A JPS6411337 A JP S6411337A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- protective film
- bonding pad
- film
- pad parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167264A JPH0680695B2 (ja) | 1987-07-03 | 1987-07-03 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167264A JPH0680695B2 (ja) | 1987-07-03 | 1987-07-03 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6411337A true JPS6411337A (en) | 1989-01-13 |
JPH0680695B2 JPH0680695B2 (ja) | 1994-10-12 |
Family
ID=15846511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62167264A Expired - Lifetime JPH0680695B2 (ja) | 1987-07-03 | 1987-07-03 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0680695B2 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03132048A (ja) * | 1989-10-18 | 1991-06-05 | Matsushita Electron Corp | 半導体装置 |
US5038739A (en) * | 1989-09-07 | 1991-08-13 | Nissan Motor Company, Ltd. | Control arrangement for multi-cylinder two cycle engine |
US5100476A (en) * | 1989-03-30 | 1992-03-31 | Kabushiki Kaisha Toshiba | Method and apparatus for cleaning semiconductor devices |
US5121187A (en) * | 1988-10-17 | 1992-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Electric device having a leadframe covered with an antioxidation film |
US5695569A (en) * | 1991-02-28 | 1997-12-09 | Texas Instruments Incorporated | Removal of metal contamination |
US5718763A (en) * | 1994-04-04 | 1998-02-17 | Tokyo Electron Limited | Resist processing apparatus for a rectangular substrate |
JP2006200926A (ja) * | 2005-01-18 | 2006-08-03 | Denso Corp | 圧力センサ |
JP2017011176A (ja) * | 2015-06-24 | 2017-01-12 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5292478A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Semiconductor device and its preparation |
JPS53103375A (en) * | 1977-02-22 | 1978-09-08 | Toshiba Corp | Semiconductor device |
JPS56162844A (en) * | 1980-05-19 | 1981-12-15 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPS5889930U (ja) * | 1981-12-12 | 1983-06-17 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
JPS6085548A (ja) * | 1983-10-17 | 1985-05-15 | Nec Corp | 集積回路装置 |
-
1987
- 1987-07-03 JP JP62167264A patent/JPH0680695B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5292478A (en) * | 1976-01-30 | 1977-08-03 | Hitachi Ltd | Semiconductor device and its preparation |
JPS53103375A (en) * | 1977-02-22 | 1978-09-08 | Toshiba Corp | Semiconductor device |
JPS56162844A (en) * | 1980-05-19 | 1981-12-15 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPS5889930U (ja) * | 1981-12-12 | 1983-06-17 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
JPS6085548A (ja) * | 1983-10-17 | 1985-05-15 | Nec Corp | 集積回路装置 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5121187A (en) * | 1988-10-17 | 1992-06-09 | Semiconductor Energy Laboratory Co., Ltd. | Electric device having a leadframe covered with an antioxidation film |
US5100476A (en) * | 1989-03-30 | 1992-03-31 | Kabushiki Kaisha Toshiba | Method and apparatus for cleaning semiconductor devices |
US5038739A (en) * | 1989-09-07 | 1991-08-13 | Nissan Motor Company, Ltd. | Control arrangement for multi-cylinder two cycle engine |
JPH03132048A (ja) * | 1989-10-18 | 1991-06-05 | Matsushita Electron Corp | 半導体装置 |
US5695569A (en) * | 1991-02-28 | 1997-12-09 | Texas Instruments Incorporated | Removal of metal contamination |
US5718763A (en) * | 1994-04-04 | 1998-02-17 | Tokyo Electron Limited | Resist processing apparatus for a rectangular substrate |
US5853803A (en) * | 1994-04-04 | 1998-12-29 | Tokyo Electron Limited | Resist processing method and apparatus |
JP2006200926A (ja) * | 2005-01-18 | 2006-08-03 | Denso Corp | 圧力センサ |
JP2017011176A (ja) * | 2015-06-24 | 2017-01-12 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH0680695B2 (ja) | 1994-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5762539A (en) | Mounting method for semiconductor element | |
JPS6411337A (en) | Semiconductor device | |
JPS56116649A (en) | Manufacturing of semiconductor device | |
JPS5769767A (en) | Resin sealed type semiconductor device | |
JPS5332672A (en) | Lead frame for semiconductor device | |
JPS55138241A (en) | Sealing structure for semiconductor device | |
JPS57173948A (en) | Manufacture of semiconductor device | |
JPS5763831A (en) | Semiconductor device | |
JPS5759389A (en) | Semiconductor strain gauge type pressure sensor | |
JPS55134325A (en) | Temperature sensor | |
JPS5656659A (en) | Semiconductor device | |
JPS57106138A (en) | Semiconductor device | |
KR900005571A (ko) | 화합물 반도체장치와 그 제조방법 | |
JPS5419624A (en) | Adhering method of adhesive tape | |
JPS5740935A (en) | Semiconductor device | |
JPS56116633A (en) | Semiconductor device | |
JPS57177538A (en) | Manufacturing method for semiconductor device | |
JPS55140249A (en) | Semiconductor device | |
JPS5411690A (en) | Semiconductor laser unit | |
JPS5796573A (en) | Semiconductor strain transducer | |
JPS57208149A (en) | Resin-sealed type semiconductor device | |
JPH10153481A (ja) | 高感度水中用光センサー及びその製造方法 | |
JPS5667946A (en) | Semiconductor system | |
JPS644029A (en) | Semiconductor device | |
JPS5365063A (en) | Semiconductor device |