JPS6410466B2 - - Google Patents

Info

Publication number

JPS6410466B2

JPS6410466B2 JP58135355A JP13535583A JPS6410466B2 JP S6410466 B2 JPS6410466 B2 JP S6410466B2 JP 58135355 A JP58135355 A JP 58135355A JP 13535583 A JP13535583 A JP 13535583A JP S6410466 B2 JPS6410466 B2 JP S6410466B2

Authority

JP

Japan

Prior art keywords

weight

cordierite

sintered body

boron nitride

silicon nitride

Prior art date

1983-07-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 15
• 229910052582 BN Inorganic materials 0.000 claims description 14
• 229910052878 cordierite Inorganic materials 0.000 claims description 14
• JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 14
• 239000000203 mixture Substances 0.000 claims description 13
• 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
• HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 7
• 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
• 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
• 238000004519 manufacturing process Methods 0.000 claims description 3
• IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
• 239000000843 powder Substances 0.000 description 9
• 239000000463 material Substances 0.000 description 7
• 229910052757 nitrogen Inorganic materials 0.000 description 6
• 230000035939 shock Effects 0.000 description 6
• 230000007797 corrosion Effects 0.000 description 4
• 238000005260 corrosion Methods 0.000 description 4
• 238000010304 firing Methods 0.000 description 4
• 229910052863 mullite Inorganic materials 0.000 description 4
• 238000000280 densification Methods 0.000 description 3
• 230000002542 deteriorative effect Effects 0.000 description 3
• KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 3
• 238000010438 heat treatment Methods 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• 239000000126 substance Substances 0.000 description 3
• ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
• LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
• UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
• 238000010521 absorption reaction Methods 0.000 description 2
• 239000000654 additive Substances 0.000 description 2
• 229910052796 boron Inorganic materials 0.000 description 2
• 229910010293 ceramic material Inorganic materials 0.000 description 2
• 238000000635 electron micrograph Methods 0.000 description 2
• 238000009472 formulation Methods 0.000 description 2
• 229910052739 hydrogen Inorganic materials 0.000 description 2
• 239000001257 hydrogen Substances 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 230000005855 radiation Effects 0.000 description 2
• 238000005245 sintering Methods 0.000 description 2
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 230000000996 additive effect Effects 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 238000001354 calcination Methods 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 238000005266 casting Methods 0.000 description 1
• 239000013078 crystal Substances 0.000 description 1
• 230000006866 deterioration Effects 0.000 description 1
• 238000009837 dry grinding Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000012772 electrical insulation material Substances 0.000 description 1
• 230000003628 erosive effect Effects 0.000 description 1
• 235000019441 ethanol Nutrition 0.000 description 1
• 238000001125 extrusion Methods 0.000 description 1
• 238000011049 filling Methods 0.000 description 1
• 238000009499 grossing Methods 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• 239000003779 heat-resistant material Substances 0.000 description 1
• 239000007791 liquid phase Substances 0.000 description 1
• 239000000314 lubricant Substances 0.000 description 1
• 238000003801 milling Methods 0.000 description 1
• 238000002156 mixing Methods 0.000 description 1
• 239000006082 mold release agent Substances 0.000 description 1
• 239000002245 particle Substances 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
• 229910010271 silicon carbide Inorganic materials 0.000 description 1
• 230000003595 spectral effect Effects 0.000 description 1
• 238000001238 wet grinding Methods 0.000 description 1