JPS6389280U - - Google Patents
Info
- Publication number
- JPS6389280U JPS6389280U JP1986185142U JP18514286U JPS6389280U JP S6389280 U JPS6389280 U JP S6389280U JP 1986185142 U JP1986185142 U JP 1986185142U JP 18514286 U JP18514286 U JP 18514286U JP S6389280 U JPS6389280 U JP S6389280U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flip chip
- board
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185142U JPS6389280U (enExample) | 1986-12-01 | 1986-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986185142U JPS6389280U (enExample) | 1986-12-01 | 1986-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389280U true JPS6389280U (enExample) | 1988-06-10 |
Family
ID=31133488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986185142U Pending JPS6389280U (enExample) | 1986-12-01 | 1986-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389280U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994005134A1 (fr) * | 1992-08-26 | 1994-03-03 | Tdk Corporation | Composant electronique |
| JPH07183333A (ja) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | 電子パッケージおよびその作製方法 |
| JPH0883818A (ja) * | 1994-09-12 | 1996-03-26 | Nec Corp | 電子部品組立体 |
-
1986
- 1986-12-01 JP JP1986185142U patent/JPS6389280U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994005134A1 (fr) * | 1992-08-26 | 1994-03-03 | Tdk Corporation | Composant electronique |
| JPH07183333A (ja) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | 電子パッケージおよびその作製方法 |
| JPH0883818A (ja) * | 1994-09-12 | 1996-03-26 | Nec Corp | 電子部品組立体 |