JPS6351449U - - Google Patents
Info
- Publication number
- JPS6351449U JPS6351449U JP1986145367U JP14536786U JPS6351449U JP S6351449 U JPS6351449 U JP S6351449U JP 1986145367 U JP1986145367 U JP 1986145367U JP 14536786 U JP14536786 U JP 14536786U JP S6351449 U JPS6351449 U JP S6351449U
- Authority
- JP
- Japan
- Prior art keywords
- flip chip
- mounting structure
- wiring
- hole
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/681—
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- H10W72/072—
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- H10W72/073—
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- H10W74/142—
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- H10W74/15—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986145367U JPS6351449U (enExample) | 1986-09-22 | 1986-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986145367U JPS6351449U (enExample) | 1986-09-22 | 1986-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351449U true JPS6351449U (enExample) | 1988-04-07 |
Family
ID=31056842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986145367U Pending JPS6351449U (enExample) | 1986-09-22 | 1986-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351449U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6201707B1 (en) | 1998-05-28 | 2001-03-13 | Sharp Kabushiki Kaisha | Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate |
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1986
- 1986-09-22 JP JP1986145367U patent/JPS6351449U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6201707B1 (en) | 1998-05-28 | 2001-03-13 | Sharp Kabushiki Kaisha | Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate |