JPS6389254U - - Google Patents
Info
- Publication number
- JPS6389254U JPS6389254U JP1986183451U JP18345186U JPS6389254U JP S6389254 U JPS6389254 U JP S6389254U JP 1986183451 U JP1986183451 U JP 1986183451U JP 18345186 U JP18345186 U JP 18345186U JP S6389254 U JPS6389254 U JP S6389254U
- Authority
- JP
- Japan
- Prior art keywords
- package
- contact member
- transfer mold
- circuits
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183451U JPS6389254U (enExample) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986183451U JPS6389254U (enExample) | 1986-11-28 | 1986-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6389254U true JPS6389254U (enExample) | 1988-06-10 |
Family
ID=31130199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986183451U Pending JPS6389254U (enExample) | 1986-11-28 | 1986-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6389254U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP2013171848A (ja) * | 2012-02-17 | 2013-09-02 | Denso Corp | モールドパッケージおよびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155555A (en) * | 1980-05-06 | 1981-12-01 | Seiko Epson Corp | Semiconductor device |
-
1986
- 1986-11-28 JP JP1986183451U patent/JPS6389254U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155555A (en) * | 1980-05-06 | 1981-12-01 | Seiko Epson Corp | Semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
| JP2013171848A (ja) * | 2012-02-17 | 2013-09-02 | Denso Corp | モールドパッケージおよびその製造方法 |