JPH0317636U - - Google Patents
Info
- Publication number
- JPH0317636U JPH0317636U JP1989078493U JP7849389U JPH0317636U JP H0317636 U JPH0317636 U JP H0317636U JP 1989078493 U JP1989078493 U JP 1989078493U JP 7849389 U JP7849389 U JP 7849389U JP H0317636 U JPH0317636 U JP H0317636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- protrusion
- semiconductor chip
- mounting pad
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/01515—
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- H10W72/075—
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- H10W72/536—
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- H10W74/00—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078493U JPH0317636U (enExample) | 1989-07-03 | 1989-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989078493U JPH0317636U (enExample) | 1989-07-03 | 1989-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317636U true JPH0317636U (enExample) | 1991-02-21 |
Family
ID=31621815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989078493U Pending JPH0317636U (enExample) | 1989-07-03 | 1989-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317636U (enExample) |
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1989
- 1989-07-03 JP JP1989078493U patent/JPH0317636U/ja active Pending