JPH01176930U - - Google Patents
Info
- Publication number
- JPH01176930U JPH01176930U JP1988074299U JP7429988U JPH01176930U JP H01176930 U JPH01176930 U JP H01176930U JP 1988074299 U JP1988074299 U JP 1988074299U JP 7429988 U JP7429988 U JP 7429988U JP H01176930 U JPH01176930 U JP H01176930U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- connector
- semiconductor device
- semiconductor
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H10W72/60—
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- H10W72/076—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/40247—Connecting the strap to a bond pad of the item
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- H10W72/07653—
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- H10W72/631—
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- H10W72/931—
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- H10W74/00—
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- H10W90/736—
Landscapes
- Thyristors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988074299U JP2528687Y2 (ja) | 1988-06-06 | 1988-06-06 | プレナ−型２端子双方向サイリスタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988074299U JP2528687Y2 (ja) | 1988-06-06 | 1988-06-06 | プレナ−型２端子双方向サイリスタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01176930U true JPH01176930U (enExample) | 1989-12-18 |
| JP2528687Y2 JP2528687Y2 (ja) | 1997-03-12 |
Family
ID=31299415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988074299U Expired - Lifetime JP2528687Y2 (ja) | 1988-06-06 | 1988-06-06 | プレナ−型２端子双方向サイリスタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528687Y2 (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246766A (en) * | 1975-10-09 | 1977-04-13 | Mitsubishi Electric Corp | Semiconductor device |
| JPS56110652U (enExample) * | 1980-01-28 | 1981-08-27 | ||
| JPS60129136U (ja) * | 1984-02-03 | 1985-08-30 | 新電元工業株式会社 | 半導体装置 |
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1988
- 1988-06-06 JP JP1988074299U patent/JP2528687Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5246766A (en) * | 1975-10-09 | 1977-04-13 | Mitsubishi Electric Corp | Semiconductor device |
| JPS56110652U (enExample) * | 1980-01-28 | 1981-08-27 | ||
| JPS60129136U (ja) * | 1984-02-03 | 1985-08-30 | 新電元工業株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2528687Y2 (ja) | 1997-03-12 |