JPS62140739U - - Google Patents
Info
- Publication number
- JPS62140739U JPS62140739U JP2853786U JP2853786U JPS62140739U JP S62140739 U JPS62140739 U JP S62140739U JP 2853786 U JP2853786 U JP 2853786U JP 2853786 U JP2853786 U JP 2853786U JP S62140739 U JPS62140739 U JP S62140739U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- integrated circuit
- board
- thermocompression
- sealing cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2853786U JPS62140739U (enExample) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2853786U JPS62140739U (enExample) | 1986-02-27 | 1986-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140739U true JPS62140739U (enExample) | 1987-09-05 |
Family
ID=30831593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2853786U Pending JPS62140739U (enExample) | 1986-02-27 | 1986-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140739U (enExample) |
-
1986
- 1986-02-27 JP JP2853786U patent/JPS62140739U/ja active Pending