JPS6457656U - - Google Patents
Info
- Publication number
- JPS6457656U JPS6457656U JP1987150143U JP15014387U JPS6457656U JP S6457656 U JPS6457656 U JP S6457656U JP 1987150143 U JP1987150143 U JP 1987150143U JP 15014387 U JP15014387 U JP 15014387U JP S6457656 U JPS6457656 U JP S6457656U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- mounting
- mounting structure
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W72/07554—
-
- H10W72/50—
-
- H10W72/522—
-
- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W90/722—
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- H10W90/724—
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987150143U JPS6457656U (enExample) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987150143U JPS6457656U (enExample) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457656U true JPS6457656U (enExample) | 1989-04-10 |
Family
ID=31423017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987150143U Pending JPS6457656U (enExample) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457656U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022074A (ja) * | 1998-07-03 | 2000-01-21 | Rohm Co Ltd | 半導体装置 |
-
1987
- 1987-09-30 JP JP1987150143U patent/JPS6457656U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022074A (ja) * | 1998-07-03 | 2000-01-21 | Rohm Co Ltd | 半導体装置 |
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