JPS62192642U - - Google Patents
Info
- Publication number
- JPS62192642U JPS62192642U JP1986081675U JP8167586U JPS62192642U JP S62192642 U JPS62192642 U JP S62192642U JP 1986081675 U JP1986081675 U JP 1986081675U JP 8167586 U JP8167586 U JP 8167586U JP S62192642 U JPS62192642 U JP S62192642U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- semiconductor device
- bump
- insulating substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07251—
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- H10W72/20—
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- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986081675U JPS62192642U (enExample) | 1986-05-29 | 1986-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986081675U JPS62192642U (enExample) | 1986-05-29 | 1986-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62192642U true JPS62192642U (enExample) | 1987-12-08 |
Family
ID=30933629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986081675U Pending JPS62192642U (enExample) | 1986-05-29 | 1986-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62192642U (enExample) |
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1986
- 1986-05-29 JP JP1986081675U patent/JPS62192642U/ja active Pending