JPS62152444U - - Google Patents
Info
- Publication number
- JPS62152444U JPS62152444U JP1986039139U JP3913986U JPS62152444U JP S62152444 U JPS62152444 U JP S62152444U JP 1986039139 U JP1986039139 U JP 1986039139U JP 3913986 U JP3913986 U JP 3913986U JP S62152444 U JPS62152444 U JP S62152444U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor element
- thermal expansion
- buffer member
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01208—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039139U JPS62152444U (enExample) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986039139U JPS62152444U (enExample) | 1986-03-19 | 1986-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62152444U true JPS62152444U (enExample) | 1987-09-28 |
Family
ID=30852035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986039139U Pending JPS62152444U (enExample) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62152444U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153750A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |
-
1986
- 1986-03-19 JP JP1986039139U patent/JPS62152444U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153750A (ja) * | 1994-08-31 | 1996-06-11 | Nec Corp | 電子デバイス組立体およびその製造方法 |