JPH0226243U - - Google Patents

Info

Publication number
JPH0226243U
JPH0226243U JP10509588U JP10509588U JPH0226243U JP H0226243 U JPH0226243 U JP H0226243U JP 10509588 U JP10509588 U JP 10509588U JP 10509588 U JP10509588 U JP 10509588U JP H0226243 U JPH0226243 U JP H0226243U
Authority
JP
Japan
Prior art keywords
semiconductor chip
bonding wire
circuit element
insulating substrate
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10509588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10509588U priority Critical patent/JPH0226243U/ja
Publication of JPH0226243U publication Critical patent/JPH0226243U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/5449—
    • H10W72/5473—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP10509588U 1988-08-08 1988-08-08 Pending JPH0226243U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10509588U JPH0226243U (enExample) 1988-08-08 1988-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10509588U JPH0226243U (enExample) 1988-08-08 1988-08-08

Publications (1)

Publication Number Publication Date
JPH0226243U true JPH0226243U (enExample) 1990-02-21

Family

ID=31337405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10509588U Pending JPH0226243U (enExample) 1988-08-08 1988-08-08

Country Status (1)

Country Link
JP (1) JPH0226243U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042738A (ja) * 2005-08-01 2007-02-15 Fuji Electric Holdings Co Ltd 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116539A (ja) * 1984-05-14 1986-01-24 ジガビツト・ロジツク・インコ−ポレイテツド パツケ−ジに収容された高速集積回路

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116539A (ja) * 1984-05-14 1986-01-24 ジガビツト・ロジツク・インコ−ポレイテツド パツケ−ジに収容された高速集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007042738A (ja) * 2005-08-01 2007-02-15 Fuji Electric Holdings Co Ltd 半導体装置

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