JPS6260034U - - Google Patents

Info

Publication number
JPS6260034U
JPS6260034U JP1985151573U JP15157385U JPS6260034U JP S6260034 U JPS6260034 U JP S6260034U JP 1985151573 U JP1985151573 U JP 1985151573U JP 15157385 U JP15157385 U JP 15157385U JP S6260034 U JPS6260034 U JP S6260034U
Authority
JP
Japan
Prior art keywords
circuit board
electronic component
lead
melting point
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985151573U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985151573U priority Critical patent/JPS6260034U/ja
Publication of JPS6260034U publication Critical patent/JPS6260034U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/724

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1985151573U 1985-10-04 1985-10-04 Pending JPS6260034U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985151573U JPS6260034U (enExample) 1985-10-04 1985-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985151573U JPS6260034U (enExample) 1985-10-04 1985-10-04

Publications (1)

Publication Number Publication Date
JPS6260034U true JPS6260034U (enExample) 1987-04-14

Family

ID=31068770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985151573U Pending JPS6260034U (enExample) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPS6260034U (enExample)

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