JPH0167746U - - Google Patents
Info
- Publication number
- JPH0167746U JPH0167746U JP1987162909U JP16290987U JPH0167746U JP H0167746 U JPH0167746 U JP H0167746U JP 1987162909 U JP1987162909 U JP 1987162909U JP 16290987 U JP16290987 U JP 16290987U JP H0167746 U JPH0167746 U JP H0167746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- wiring board
- flip
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/724—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162909U JPH0167746U (enExample) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162909U JPH0167746U (enExample) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167746U true JPH0167746U (enExample) | 1989-05-01 |
Family
ID=31447164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162909U Pending JPH0167746U (enExample) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167746U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04282836A (ja) * | 1990-10-22 | 1992-10-07 | Internatl Business Mach Corp <Ibm> | 薄膜積層体における障壁の改良 |
-
1987
- 1987-10-23 JP JP1987162909U patent/JPH0167746U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04282836A (ja) * | 1990-10-22 | 1992-10-07 | Internatl Business Mach Corp <Ibm> | 薄膜積層体における障壁の改良 |