JPH0192143U - - Google Patents
Info
- Publication number
- JPH0192143U JPH0192143U JP1987189105U JP18910587U JPH0192143U JP H0192143 U JPH0192143 U JP H0192143U JP 1987189105 U JP1987189105 U JP 1987189105U JP 18910587 U JP18910587 U JP 18910587U JP H0192143 U JPH0192143 U JP H0192143U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonded
- chip
- semiconductor
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/248—
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- H10W72/877—
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- H10W72/884—
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- H10W90/724—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189105U JPH0192143U (enExample) | 1987-12-10 | 1987-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987189105U JPH0192143U (enExample) | 1987-12-10 | 1987-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0192143U true JPH0192143U (enExample) | 1989-06-16 |
Family
ID=31480160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987189105U Pending JPH0192143U (enExample) | 1987-12-10 | 1987-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0192143U (enExample) |
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1987
- 1987-12-10 JP JP1987189105U patent/JPH0192143U/ja active Pending