JPS62134254U - - Google Patents
Info
- Publication number
- JPS62134254U JPS62134254U JP1986020628U JP2062886U JPS62134254U JP S62134254 U JPS62134254 U JP S62134254U JP 1986020628 U JP1986020628 U JP 1986020628U JP 2062886 U JP2062886 U JP 2062886U JP S62134254 U JPS62134254 U JP S62134254U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- semiconductor wafer
- wafer chip
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5449—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986020628U JPS62134254U (enExample) | 1986-02-14 | 1986-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986020628U JPS62134254U (enExample) | 1986-02-14 | 1986-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62134254U true JPS62134254U (enExample) | 1987-08-24 |
Family
ID=30816321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986020628U Pending JPS62134254U (enExample) | 1986-02-14 | 1986-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62134254U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258359A (ja) * | 1988-08-24 | 1990-02-27 | Ibiden Co Ltd | 電子部品装置 |
| JP2011108924A (ja) * | 2009-11-19 | 2011-06-02 | Nec Access Technica Ltd | 熱伝導基板及びその電子部品実装方法 |
-
1986
- 1986-02-14 JP JP1986020628U patent/JPS62134254U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0258359A (ja) * | 1988-08-24 | 1990-02-27 | Ibiden Co Ltd | 電子部品装置 |
| JP2011108924A (ja) * | 2009-11-19 | 2011-06-02 | Nec Access Technica Ltd | 熱伝導基板及びその電子部品実装方法 |