JPS6379926A - ボンデイングワイヤ - Google Patents

ボンデイングワイヤ

Info

Publication number
JPS6379926A
JPS6379926A JP61225653A JP22565386A JPS6379926A JP S6379926 A JPS6379926 A JP S6379926A JP 61225653 A JP61225653 A JP 61225653A JP 22565386 A JP22565386 A JP 22565386A JP S6379926 A JPS6379926 A JP S6379926A
Authority
JP
Japan
Prior art keywords
bonding
copper
purity
wire
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61225653A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0123540B2 (index.php
Inventor
Akito Kurosaka
昭人 黒坂
Haruo Tominaga
晴夫 冨永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP61225653A priority Critical patent/JPS6379926A/ja
Publication of JPS6379926A publication Critical patent/JPS6379926A/ja
Publication of JPH0123540B2 publication Critical patent/JPH0123540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H10W72/01515—
    • H10W72/01551—
    • H10W72/01565—
    • H10W72/07533—
    • H10W72/50—
    • H10W72/522—
    • H10W72/551—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/555—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP61225653A 1986-09-24 1986-09-24 ボンデイングワイヤ Granted JPS6379926A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61225653A JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61225653A JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Publications (2)

Publication Number Publication Date
JPS6379926A true JPS6379926A (ja) 1988-04-09
JPH0123540B2 JPH0123540B2 (index.php) 1989-05-02

Family

ID=16832663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61225653A Granted JPS6379926A (ja) 1986-09-24 1986-09-24 ボンデイングワイヤ

Country Status (1)

Country Link
JP (1) JPS6379926A (index.php)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
US6120585A (en) * 1996-05-15 2000-09-19 Matsushita Electric Industrial Co., Ltd. Reflow soldering device
WO2003036710A1 (en) * 2001-10-23 2003-05-01 Sumitomo Electric Wintec, Incorporated Bonding wire
JP2006190763A (ja) * 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2007012776A (ja) * 2005-06-29 2007-01-18 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ
JP2010272884A (ja) * 2010-08-03 2010-12-02 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
US6120585A (en) * 1996-05-15 2000-09-19 Matsushita Electric Industrial Co., Ltd. Reflow soldering device
WO2003036710A1 (en) * 2001-10-23 2003-05-01 Sumitomo Electric Wintec, Incorporated Bonding wire
JP2006190763A (ja) * 2005-01-05 2006-07-20 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2006216929A (ja) * 2005-01-05 2006-08-17 Nippon Steel Corp 半導体装置用ボンディングワイヤ
JP2007012776A (ja) * 2005-06-29 2007-01-18 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ
JP2010272884A (ja) * 2010-08-03 2010-12-02 Nippon Steel Materials Co Ltd 半導体装置用ボンディングワイヤ

Also Published As

Publication number Publication date
JPH0123540B2 (index.php) 1989-05-02

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