JPS6379634U - - Google Patents
Info
- Publication number
- JPS6379634U JPS6379634U JP17380986U JP17380986U JPS6379634U JP S6379634 U JPS6379634 U JP S6379634U JP 17380986 U JP17380986 U JP 17380986U JP 17380986 U JP17380986 U JP 17380986U JP S6379634 U JPS6379634 U JP S6379634U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafers
- boat
- aligned
- furnace core
- core tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
Description
第１図は本考案に係る熱処理装置の一実施例を
示す部分概略側断面図、第２図と第３図と第４図
は本考案に係る別体漏斗状ダミーウエーハの正面
図と下面図と側面図である。第５図は従来の熱処
理装置の一具体例を示す部分概略側断面図、第６
図は半導体ウエーハの平面図である。
１……炉芯管、１ａ……炉芯管開口端、２……
半導体ウエーハ、３……ボート、４……ヒータ、
６……処理ガス、７……漏斗状ダミーウエーハ。
FIG. 1 is a partial schematic side sectional view showing an embodiment of the heat treatment apparatus according to the present invention, and FIGS. 2, 3, and 4 are front and bottom views of separate funnel-shaped dummy wafers according to the present invention. and a side view. FIG. 5 is a partial schematic side sectional view showing a specific example of a conventional heat treatment apparatus, and FIG.
The figure is a plan view of a semiconductor wafer. 1...Furnace core tube, 1a...Furnace core tube open end, 2...
Semiconductor wafer, 3...Boat, 4...Heater,
6... Processing gas, 7... Funnel-shaped dummy wafer.
Claims (1)
と略垂直方向に所定の間隔で整列・支持すると共
に、炉芯管内にその管軸に沿つて上記半導体ウエ
ーハが整列するように上記ボートを搬入し、上記
炉芯管の一方開口端より処理ガスを導入して上記
半導体ウエーハを熱処理する装置において、 上記半導体ウエーハ間に漏斗状ダミーウエーハ
を上記半導体ウエーハと略同一姿勢で、かつ、径
大開口面をガス導入側に向けて配設したことを特
徴とする熱処理装置。[Claim for Utility Model Registration] A plurality of semiconductor wafers are aligned and supported in a boat at predetermined intervals in a direction substantially perpendicular to the surface to be processed, and the semiconductor wafers are aligned in a furnace core tube along the tube axis. In an apparatus for heat-treating the semiconductor wafers by bringing in the boat and introducing processing gas from one open end of the furnace core tube, a funnel-shaped dummy wafer is placed between the semiconductor wafers in substantially the same posture as the semiconductor wafers. A heat treatment apparatus characterized in that the large-diameter opening surface is disposed facing the gas introduction side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17380986U JPS6379634U (en) | 1986-11-12 | 1986-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17380986U JPS6379634U (en) | 1986-11-12 | 1986-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6379634U true JPS6379634U (en) | 1988-05-26 |
Family
ID=31111620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17380986U Pending JPS6379634U (en) | 1986-11-12 | 1986-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6379634U (en) |
-
1986
- 1986-11-12 JP JP17380986U patent/JPS6379634U/ja active Pending
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