JPS605218B2 - Heat balance jig - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat balance jig suitable for use by being placed in a heat treatment furnace for performing various heat treatments (for example, diffusion, oxidation, annealing, etc.) in the semiconductor industry.

Conventionally, in a heat treatment furnace of this kind, as shown in FIG. Attempts are being made to place .

The purpose of arranging these heat balance wafers 14 and 22 is to ensure that the wafers 18 to be processed on the wafer holder 16 disposed at the center of the furnace are uniformly affected by the gas atmosphere and temperature distribution. Usually, wafers 14, 22
In this method, several to several tens of silicon wafers having the same size, shape, and material as the wafer to be processed are arranged, but these wafers 14 and 22 are loaded and unloaded each time the wafer to be processed 18 is loaded and unloaded. Since the wafer is taken out, it is troublesome to handle it, and there is the inconvenience that the wafer may break or fall during this process, and there is also the inconvenience that the inside of the furnace is contaminated due to the wafer being broken or thrown down. An object of the present invention is to provide a novel heat balance fixture that eliminates the inconveniences and inconveniences of the prior art described above.

One embodiment of the present invention has a silicon cylinder having circular grooves near both ends, and a gas flow and a cutting wafer each inserted into the circular grooves. This combination simulates the conventional arrangement of a large number of heat balance wafers.

This feature not only provides a uniform gas atmosphere or temperature distribution similar to that of conventional wafer arrays, but also eliminates most of the inconveniences and inconveniences associated with handling wafers, especially preventing wafer breakage and contamination in the furnace. Decrease sharply. next,
The invention will now be described in detail with reference to embodiments illustrated in the accompanying drawings.

2 and 3 show a heat balance pick-up tool according to an embodiment of the present invention, and a cross section taken along the low D line in FIG. 3 is shown in FIG.

In these figures, the heat balance tool 30 includes a cylinder 32 made of polysilicon with circular grooves 34 and 36 formed near both ends, and a gas cylinder 32 that is inserted into the circular grooves 34 and 36, respectively. Silicon wafer for sink or break 38,
It has 40. One or more ring-shaped grooves may be provided in addition to the grooves 34 and 36 described above, and a wafer can be inserted into each groove. A flat portion 32a is formed on the bottom surface of the silicon cylinder 32 in order to maintain a stable state without rolling when placed in a furnace. If desired, this flat portion 32a may be provided with a pin hole so that it can be pinned in the furnace. Alternatively, the portion corresponding to the flat portion 32a may be divided. It prevents gas flow from blowing through the cylinder of the wafers 38 and 4, and also functions to block radiant heat from the wafers to be processed. wafer 38,
Although it is preferable that the size and shape of the four wafers are the same as those of the wafer to be processed, they do not necessarily have to be the same. The heat balance sacrificial tool 30 according to the present invention is used, for example, as shown in FIG.

In FIG. 4, reference numerals 30A and 30B denote heat balance waste tools, which are disposed at the inlet and outlet sides of the gas G in the furnace body 10, respectively. A silicon wafer 18 to be processed held by a wafer holder 16 is placed between the jigs 30A and 308. It has been confirmed that by arranging the heat balance filters 30A and 30B on both sides of the wafer 18 in this way, it is possible to obtain the same effect of homogenizing the gas atmosphere and temperature distribution as in the case of the slave shown in FIG. . Furthermore, the jigs 30A and 30B were easy to handle, and there was almost no damage to the wafers 38 and 40.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing the arrangement inside a conventional heat treatment furnace, FIG. 2 is a sectional view of a heat balance pick-up according to an embodiment of the present invention, and FIG. 3 is a sectional view of the jig shown in FIG. 2. side view, 4th
The figure is a sectional view showing the arrangement inside a heat treatment furnace using the heat balance pick-up according to the present invention. 10... Heat treatment furnace body, 12, 16, 20...
・・・．・Wafer holder, 14, 22... Wafer for heat balance, 18... Processing wafer, 30,
30A, 30B...Heat balance fitting, 32...Silicon cylinder, 34, 36...Rin-shaped groove, 38, 40
...Gas flow and cutting wafer. Souzu younger brother Zzushu 3zuzu 4zuzu

Claims (1)

[Claims] 1 A heat balance jig to be placed on the gas inlet side or the gas outlet side in a heat treatment furnace, which includes a silicon cylinder in which circular grooves are formed near both ends, and the silicon cylinder's circular grooves. A heat balance jig characterized by having a gas flow and a cutting wafer inserted into each of the shaped grooves.