JPS637459B2 - - Google Patents

Info

Publication number
JPS637459B2
JPS637459B2 JP55148599A JP14859980A JPS637459B2 JP S637459 B2 JPS637459 B2 JP S637459B2 JP 55148599 A JP55148599 A JP 55148599A JP 14859980 A JP14859980 A JP 14859980A JP S637459 B2 JPS637459 B2 JP S637459B2
Authority
JP
Japan
Prior art keywords
chip
package
semiconductor chip
resin
ceramic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55148599A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5772338A (en
Inventor
Teiichi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55148599A priority Critical patent/JPS5772338A/ja
Publication of JPS5772338A publication Critical patent/JPS5772338A/ja
Publication of JPS637459B2 publication Critical patent/JPS637459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP55148599A 1980-10-23 1980-10-23 Manufacture of semiconductor device Granted JPS5772338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148599A JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148599A JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5772338A JPS5772338A (en) 1982-05-06
JPS637459B2 true JPS637459B2 (https=) 1988-02-17

Family

ID=15456357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148599A Granted JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5772338A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223876A (ja) * 1990-12-26 1992-08-13 Mitsubishi Materials Corp レンズ研削用砥石

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6150353A (ja) * 1984-08-20 1986-03-12 Oki Electric Ind Co Ltd Ｅｐｒｏｍ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223876A (ja) * 1990-12-26 1992-08-13 Mitsubishi Materials Corp レンズ研削用砥石

Also Published As

Publication number Publication date
JPS5772338A (en) 1982-05-06

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