JPS637124B2 - - Google Patents
Info
- Publication number
- JPS637124B2 JPS637124B2 JP15382282A JP15382282A JPS637124B2 JP S637124 B2 JPS637124 B2 JP S637124B2 JP 15382282 A JP15382282 A JP 15382282A JP 15382282 A JP15382282 A JP 15382282A JP S637124 B2 JPS637124 B2 JP S637124B2
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- single crystal
- crystal orientation
- plane
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013078 crystal Substances 0.000 claims description 68
- 238000000034 method Methods 0.000 claims description 9
- 238000003672 processing method Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000000137 annealing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57153822A JPS5942916A (ja) | 1982-09-06 | 1982-09-06 | 単結晶の加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57153822A JPS5942916A (ja) | 1982-09-06 | 1982-09-06 | 単結晶の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5942916A JPS5942916A (ja) | 1984-03-09 |
JPS637124B2 true JPS637124B2 (de) | 1988-02-15 |
Family
ID=15570846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57153822A Granted JPS5942916A (ja) | 1982-09-06 | 1982-09-06 | 単結晶の加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5942916A (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01110910A (ja) * | 1987-10-26 | 1989-04-27 | Toshiba Corp | 薄板切断方法および薄板切断装置 |
RU2440885C2 (ru) * | 2007-06-25 | 2012-01-27 | Сэнт-Гобэн Керамикс Энд Пластикс, Инк. | Способ изменения кристаллографической ориентации монокристаллического тела (варианты) и устройство для его осуществления |
CN102785298B (zh) * | 2012-07-09 | 2015-10-28 | 浙江上城科技有限公司 | 一种蓝宝石工件粘胶台 |
CN110065171B (zh) * | 2019-04-25 | 2021-12-24 | 西安奕斯伟材料科技有限公司 | 一种切割装置和晶棒的切割方法 |
-
1982
- 1982-09-06 JP JP57153822A patent/JPS5942916A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5942916A (ja) | 1984-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970009861B1 (ko) | 반도체 웨이퍼의 제조방법 | |
JP3213563B2 (ja) | ノッチレスウェーハの製造方法 | |
JP2805370B2 (ja) | 内周刃式ソーを用いてロッド状のワークピースを薄板にスライス切断する方法 | |
JPS637124B2 (de) | ||
JP3205402B2 (ja) | 結晶方位決定方法及び装置 | |
TW201936350A (zh) | 半導體單結晶鑄錠的切片方法 | |
US4755314A (en) | Single crystal wafer of lithium tantalate | |
US4165402A (en) | Chip-removing machining method and apparatus for semiconducting crystals, specifically suited for the production of force and pressure measuring cells | |
CN109967788B (zh) | 储能极板切刀位置校准装置及其校准方法 | |
JPH10337695A (ja) | 半導体単結晶インゴットの接着方法及びスライス方法 | |
JP3918216B2 (ja) | 単結晶の切断装置と方法 | |
JP2909945B2 (ja) | 種棒切断方法 | |
US2392271A (en) | Manufacture of piezoelectric elements | |
US6055842A (en) | Method for calibrating rotating tools | |
JP2001272359A (ja) | 単結晶インゴットの処理装置及び処理方法 | |
JPS5849904A (ja) | 金属ミラ− | |
JPH10119032A (ja) | 劈開性を持つ単結晶インゴットの切断加工時の結晶方位合わせ方法 | |
JPS63149072A (ja) | 板材の切り出し方法 | |
JP2005169667A (ja) | 水晶ランバード原石及び水晶板の製造方法、並びに水晶ランバード原石 | |
KR20050020271A (ko) | 실리콘 단결정 웨이퍼의 제조방법 및 제조장치 | |
JP4797276B2 (ja) | 単結晶インゴットの切断方法 | |
KR0178787B1 (ko) | LiTaO3 단결정의 절단 방법 | |
JP2002139463A (ja) | 単結晶高精度方向角測定装置 | |
KR900002079B1 (ko) | 웨이퍼의 제조방법 | |
JPS6333992B2 (de) |