JPS6366423B2 - - Google Patents

Info

Publication number
JPS6366423B2
JPS6366423B2 JP56177737A JP17773781A JPS6366423B2 JP S6366423 B2 JPS6366423 B2 JP S6366423B2 JP 56177737 A JP56177737 A JP 56177737A JP 17773781 A JP17773781 A JP 17773781A JP S6366423 B2 JPS6366423 B2 JP S6366423B2
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
bonding
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56177737A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5879728A (ja
Inventor
Takeshi Hasegawa
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56177737A priority Critical patent/JPS5879728A/ja
Publication of JPS5879728A publication Critical patent/JPS5879728A/ja
Publication of JPS6366423B2 publication Critical patent/JPS6366423B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP56177737A 1981-11-05 1981-11-05 ワイヤボンデイング方法 Granted JPS5879728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5879728A JPS5879728A (ja) 1983-05-13
JPS6366423B2 true JPS6366423B2 (enExample) 1988-12-20

Family

ID=16036238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177737A Granted JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5879728A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3951299B2 (ja) 2003-02-20 2007-08-01 ソニー株式会社 レンズアダプタ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5951742B2 (ja) * 1979-11-10 1984-12-15 株式会社新川 超音波ワイヤボンデイング方法

Also Published As

Publication number Publication date
JPS5879728A (ja) 1983-05-13

Similar Documents

Publication Publication Date Title
US5981371A (en) Bump forming method
US5024367A (en) Wire bonding method
JP3377748B2 (ja) ワイヤボンディング方法
JP3049515B2 (ja) ワイヤボンデイング方法
US20020023942A1 (en) Wire bonding apparatus
JPS6366423B2 (enExample)
KR102411252B1 (ko) 와이어 본딩 장치
JPH02273944A (ja) リード付き半導体素子の製造方法
JPS6256659B2 (enExample)
JPH09162224A (ja) 被覆ワイヤのワイヤボンディング方法
JPS5826665B2 (ja) ワイヤボンデイング方法
JP7542895B1 (ja) ワイヤボンディング装置
JPS5855665B2 (ja) ワイヤボンデイング方法
JP3478510B2 (ja) ワイヤボンディング装置
JPS5951742B2 (ja) 超音波ワイヤボンデイング方法
JPS6081835A (ja) 自動ボンデイングワイヤ−通し機構
JPS6035526A (ja) ワイヤボンディング方法
JPS62179733A (ja) ワイヤボンデイング方式
JPS5858737A (ja) ワイヤボンデイング方法
KR100413477B1 (ko) 와이어 본더의 본더헤드
JPH02273952A (ja) キヤピラリへのワイヤ通し方法
JPH0228338A (ja) ワイヤボンディング方法
JPS6135698B2 (enExample)
JPS6158977B2 (enExample)
JPS6298629A (ja) ワイヤボンデイング方法