JPS5879728A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS5879728A
JPS5879728A JP56177737A JP17773781A JPS5879728A JP S5879728 A JPS5879728 A JP S5879728A JP 56177737 A JP56177737 A JP 56177737A JP 17773781 A JP17773781 A JP 17773781A JP S5879728 A JPS5879728 A JP S5879728A
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
cut
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56177737A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366423B2 (enExample
Inventor
Takeshi Hasegawa
猛 長谷川
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56177737A priority Critical patent/JPS5879728A/ja
Publication of JPS5879728A publication Critical patent/JPS5879728A/ja
Publication of JPS6366423B2 publication Critical patent/JPS6366423B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07533—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—

Landscapes

  • Wire Bonding (AREA)
JP56177737A 1981-11-05 1981-11-05 ワイヤボンデイング方法 Granted JPS5879728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56177737A JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5879728A true JPS5879728A (ja) 1983-05-13
JPS6366423B2 JPS6366423B2 (enExample) 1988-12-20

Family

ID=16036238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56177737A Granted JPS5879728A (ja) 1981-11-05 1981-11-05 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS5879728A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489359B2 (en) 2003-02-20 2009-02-10 Sony Corporation Lens adapter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681947A (en) * 1979-11-10 1981-07-04 Shinkawa Ltd Ultrasonic wave wire bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681947A (en) * 1979-11-10 1981-07-04 Shinkawa Ltd Ultrasonic wave wire bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489359B2 (en) 2003-02-20 2009-02-10 Sony Corporation Lens adapter

Also Published As

Publication number Publication date
JPS6366423B2 (enExample) 1988-12-20

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