JPS6366418B2 - - Google Patents
Info
- Publication number
- JPS6366418B2 JPS6366418B2 JP57167515A JP16751582A JPS6366418B2 JP S6366418 B2 JPS6366418 B2 JP S6366418B2 JP 57167515 A JP57167515 A JP 57167515A JP 16751582 A JP16751582 A JP 16751582A JP S6366418 B2 JPS6366418 B2 JP S6366418B2
- Authority
- JP
- Japan
- Prior art keywords
- sio
- film
- layer
- resin
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167515A JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167515A JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5957437A JPS5957437A (ja) | 1984-04-03 |
| JPS6366418B2 true JPS6366418B2 (cs) | 1988-12-20 |
Family
ID=15851110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57167515A Granted JPS5957437A (ja) | 1982-09-28 | 1982-09-28 | 酸化珪素膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5957437A (cs) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129153A (ja) * | 1984-07-20 | 1986-02-10 | Fujitsu Ltd | 凹凸基板の平坦化方法 |
| JPS6230335A (ja) * | 1985-07-31 | 1987-02-09 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62219928A (ja) * | 1986-03-20 | 1987-09-28 | Fujitsu Ltd | 絶縁膜の形成方法 |
| DE69327176T2 (de) | 1992-07-04 | 2000-05-31 | Trikon Equipments Ltd., Littleton-Upon-Severn | Behandlungsverfahren für eine halbleiterscheibe. |
-
1982
- 1982-09-28 JP JP57167515A patent/JPS5957437A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5957437A (ja) | 1984-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1150346B1 (en) | A process for preparing insulating material having low dielectric constant | |
| JPS63107122A (ja) | 凹凸基板の平坦化方法 | |
| JP3174417B2 (ja) | 酸化ケイ素膜の形成方法 | |
| JP3174416B2 (ja) | 酸化ケイ素膜の形成方法 | |
| US5472488A (en) | Coating solution for forming glassy layers | |
| EP0517475B1 (en) | Process for coating a substrate with a silica precursor | |
| JP3646087B2 (ja) | 半導体層間絶縁膜の形成方法 | |
| JPS59178749A (ja) | 配線構造体 | |
| CN100383147C (zh) | 多官能环状硅氧烷化合物和由该化合物制备的硅氧烷基聚合物和用该聚合物制备介电薄膜的方法 | |
| KR20020025992A (ko) | Ulsi 적용에 사용되는 실록산 중합체로 처리된나노다공성 실리카 | |
| JP2003512383A (ja) | オルガノセスキシロキサン前駆体を使用する膜の堆積 | |
| KR20040043160A (ko) | 실록산 수지 | |
| JP3543669B2 (ja) | 絶縁膜形成用塗布液及び絶縁膜の形成方法 | |
| KR100507967B1 (ko) | 실록산계 수지 및 이를 이용한 반도체 층간 절연막 | |
| KR100504291B1 (ko) | 게르마늄을 포함하는 실록산계 수지 및 이를 이용한반도체 층간 절연막 형성 방법 | |
| TW593548B (en) | Siloxane resins | |
| JP2000106363A (ja) | 不溶性コ―ティングの形成方法 | |
| WO2008082128A1 (en) | Norbornene-based silsesquioxane copolymers, norbornene-based silane derivative used for preparation of the same and method of preparing low dielectric insulating film comprising the same | |
| JPS6366418B2 (cs) | ||
| JPS60124943A (ja) | 酸化珪素膜の形成方法 | |
| JP3229419B2 (ja) | 酸化ケイ素膜の形成方法 | |
| US6908977B2 (en) | Siloxane-based resin and method of forming an insulating film between interconnect layers of a semiconductor device using the same | |
| KR20010094928A (ko) | 전기 절연성 박막 형성성 수지 조성물 및 이로부터의박막의 형성방법 | |
| JP2002201416A (ja) | 半導体用シリカ系被膜形成用塗布液、半導体用シリカ系被膜及び半導体装置 | |
| TW591057B (en) | Siloxane resins |