JPS6366055B2 - - Google Patents

Info

Publication number
JPS6366055B2
JPS6366055B2 JP55076747A JP7674780A JPS6366055B2 JP S6366055 B2 JPS6366055 B2 JP S6366055B2 JP 55076747 A JP55076747 A JP 55076747A JP 7674780 A JP7674780 A JP 7674780A JP S6366055 B2 JPS6366055 B2 JP S6366055B2
Authority
JP
Japan
Prior art keywords
assembly tape
manufacturing
semiconductor substrate
station
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55076747A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5693338A (en
Inventor
Binkuraa Kuruto
Haitsuraa Bikutooru
Aruburehito Andoreasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
Deutsche ITT Industries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH filed Critical Deutsche ITT Industries GmbH
Publication of JPS5693338A publication Critical patent/JPS5693338A/ja
Publication of JPS6366055B2 publication Critical patent/JPS6366055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/045—
    • H10W70/456—
    • H10W72/0711—
    • H10W72/015—
    • H10W72/01571—
    • H10W72/0198—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/354—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W90/754—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP7674780A 1979-06-09 1980-06-09 Planar semiconductor device and method and apparatus for manufacturing same Granted JPS5693338A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792923440 DE2923440A1 (de) 1979-06-09 1979-06-09 Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen

Publications (2)

Publication Number Publication Date
JPS5693338A JPS5693338A (en) 1981-07-28
JPS6366055B2 true JPS6366055B2 (cg-RX-API-DMAC10.html) 1988-12-19

Family

ID=6072868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7674780A Granted JPS5693338A (en) 1979-06-09 1980-06-09 Planar semiconductor device and method and apparatus for manufacturing same

Country Status (3)

Country Link
EP (1) EP0020857B1 (cg-RX-API-DMAC10.html)
JP (1) JPS5693338A (cg-RX-API-DMAC10.html)
DE (2) DE2923440A1 (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754337A (en) * 1980-09-19 1982-03-31 Toshiba Corp Assembling apparatus for semiconductor device
JPS58169918A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd ワイヤボンダ
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
JPS60225450A (ja) * 1984-04-24 1985-11-09 Furukawa Electric Co Ltd:The 半導体装置の製造法
JPH088255B2 (ja) * 1990-02-20 1996-01-29 株式会社東芝 半導体基板表面処理方法および半導体基板表面処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439349B2 (de) * 1964-03-26 1971-02-25 Siemens AG, 1000 Berlin u 8000 München Verfahren zur serienfertigung von halbleiterbauelementen
DE1514561C3 (de) * 1965-09-06 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum serienmäßigen Herstellen von Halbleiterbauelementen
DE1627649C3 (de) * 1967-09-29 1973-10-11 Veb Elektromat, X 8080 Dresden Vorrichtung zum flächigen stoff schlussigen Verbinden eines Halbleiter korpers mit einem Metallstreifen mittels
GB1275343A (en) * 1970-04-02 1972-05-24 Ferranti Ltd Improvements relating to lead frames for use with semiconductor devices
NL7204573A (cg-RX-API-DMAC10.html) * 1972-04-06 1973-10-09
US3982317A (en) * 1975-07-31 1976-09-28 Sprague Electric Company Method for continuous assembly and batch molding of transistor packages
DE2546443C3 (de) * 1975-10-16 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Zusammengesetzte Mikroschaltung und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
EP0020857A1 (de) 1981-01-07
EP0020857B1 (de) 1984-06-13
JPS5693338A (en) 1981-07-28
DE3068157D1 (en) 1984-07-19
DE2923440A1 (de) 1980-12-11

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