JPS6365507B2 - - Google Patents
Info
- Publication number
- JPS6365507B2 JPS6365507B2 JP62315476A JP31547687A JPS6365507B2 JP S6365507 B2 JPS6365507 B2 JP S6365507B2 JP 62315476 A JP62315476 A JP 62315476A JP 31547687 A JP31547687 A JP 31547687A JP S6365507 B2 JPS6365507 B2 JP S6365507B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- resin
- unsaturated polyester
- cellulose fibers
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 52
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000011888 foil Substances 0.000 claims description 33
- 229920003043 Cellulose fiber Polymers 0.000 claims description 29
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 29
- 239000004640 Melamine resin Substances 0.000 claims description 20
- 229920000877 Melamine resin Polymers 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 229920006122 polyamide resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 229920006305 unsaturated polyester Polymers 0.000 claims 1
- 238000001723 curing Methods 0.000 description 14
- 239000000123 paper Substances 0.000 description 13
- 239000002904 solvent Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000003054 catalyst Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- -1 aliphatic peroxides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- RZRNAYUHWVFMIP-UHFFFAOYSA-N monoelaidin Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62315476A JPS63165140A (ja) | 1987-12-10 | 1987-12-10 | 金属箔張り積層板の連続製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62315476A JPS63165140A (ja) | 1987-12-10 | 1987-12-10 | 金属箔張り積層板の連続製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63165140A JPS63165140A (ja) | 1988-07-08 |
JPS6365507B2 true JPS6365507B2 (zh) | 1988-12-15 |
Family
ID=18065814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62315476A Granted JPS63165140A (ja) | 1987-12-10 | 1987-12-10 | 金属箔張り積層板の連続製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63165140A (zh) |
-
1987
- 1987-12-10 JP JP62315476A patent/JPS63165140A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63165140A (ja) | 1988-07-08 |
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