JPS6365507B2 - - Google Patents

Info

Publication number
JPS6365507B2
JPS6365507B2 JP62315476A JP31547687A JPS6365507B2 JP S6365507 B2 JPS6365507 B2 JP S6365507B2 JP 62315476 A JP62315476 A JP 62315476A JP 31547687 A JP31547687 A JP 31547687A JP S6365507 B2 JPS6365507 B2 JP S6365507B2
Authority
JP
Japan
Prior art keywords
metal foil
resin
unsaturated polyester
cellulose fibers
clad laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP62315476A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63165140A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP62315476A priority Critical patent/JPS63165140A/ja
Publication of JPS63165140A publication Critical patent/JPS63165140A/ja
Publication of JPS6365507B2 publication Critical patent/JPS6365507B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
JP62315476A 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法 Granted JPS63165140A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62315476A JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62315476A JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Publications (2)

Publication Number Publication Date
JPS63165140A JPS63165140A (ja) 1988-07-08
JPS6365507B2 true JPS6365507B2 (zh) 1988-12-15

Family

ID=18065814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62315476A Granted JPS63165140A (ja) 1987-12-10 1987-12-10 金属箔張り積層板の連続製造方法

Country Status (1)

Country Link
JP (1) JPS63165140A (zh)

Also Published As

Publication number Publication date
JPS63165140A (ja) 1988-07-08

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