JPS6364916B2 - - Google Patents
Info
- Publication number
- JPS6364916B2 JPS6364916B2 JP1775182A JP1775182A JPS6364916B2 JP S6364916 B2 JPS6364916 B2 JP S6364916B2 JP 1775182 A JP1775182 A JP 1775182A JP 1775182 A JP1775182 A JP 1775182A JP S6364916 B2 JPS6364916 B2 JP S6364916B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- group
- leads
- tape carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1775182A JPS58134454A (ja) | 1982-02-05 | 1982-02-05 | リ−ドボンデイング構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1775182A JPS58134454A (ja) | 1982-02-05 | 1982-02-05 | リ−ドボンデイング構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58134454A JPS58134454A (ja) | 1983-08-10 |
JPS6364916B2 true JPS6364916B2 (de) | 1988-12-14 |
Family
ID=11952437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1775182A Granted JPS58134454A (ja) | 1982-02-05 | 1982-02-05 | リ−ドボンデイング構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58134454A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0770560B2 (ja) * | 1985-03-15 | 1995-07-31 | 松下電器産業株式会社 | デイスプレイパネルの実装体 |
JPH0773154B2 (ja) * | 1986-04-10 | 1995-08-02 | 松下電器産業株式会社 | リ−ド接続方法 |
JPH0719943B2 (ja) * | 1986-07-04 | 1995-03-06 | 日本電気株式会社 | 電子部品の実装構造 |
JPH03119786A (ja) * | 1989-09-30 | 1991-05-22 | Toshiba Corp | 半導体装置 |
FR2749974B1 (fr) | 1996-06-13 | 1998-08-14 | Bull Sa | Procede de montage d'un circuit integre sur un support et support en resultant |
-
1982
- 1982-02-05 JP JP1775182A patent/JPS58134454A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58134454A (ja) | 1983-08-10 |
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