JPS6364391A - Method of high density mounting of electronic parts - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for high-density packaging of electronic components used in various electronic devices, control equipment, and the like.

2. Description of the Related Art A conventional electronic component mounting method will be explained with reference to FIG.
A terminal 10.1 of an integrated circuit element (hereinafter referred to as an IC) 103 housed in a dual in-line package (DIP) is inserted into the terminal 02. At the same time, the chip type electronic component 105 is bonded to the circuit board 101 with an adhesive 106, and the leads 108 of the electronic component 107 with leads are inserted into the holes 109 of the circuit board 101. After that, IC10
The terminal 104 of No. 3, the electrode 110 of the electronic component 105, and the lead 108 of the electronic component 107 are connected to the circuit board 101 by soldering 111.

Problems to be Solved by the Invention However, in the above conventional example, all the electronic components including the IC 103 are arranged flat on the circuit board 1.01, so it is difficult to obtain high-density mounting of the electronic components. In this case, there is a problem that the substrate area becomes large and it is not possible to miniaturize electronic devices or the like.

Therefore, the present invention solves these conventional problems, and allows electronic components to be mounted at low cost and with high density, and also reduces the area occupied by a circuit board on a plane, thereby allowing electronic devices, etc. It is an object of the present invention to provide a high-density mounting method for electronic components, which makes it possible to reduce the size of electronic components, facilitate wiring, and improve functionality.

Means for solving the problems and technical means of the present invention for solving the above problems are to connect a part of the external electrode of an integrated circuit element only to an electronic component that is not connected to other circuits, and to The remaining external electrodes of the circuit elements are connected to the circuit board;

According to the present invention, with the above configuration, the peripheral electronic components of the integrated circuit element can be accommodated within the area of the integrated circuit element by using the external electrodes of the integrated circuit element as they are, so that the area of the circuit board can be reduced at low cost. This makes it possible to miniaturize electronic devices and the like, and also enables high-density mounting of electronic components, resulting in higher functionality. Although the overall height is increased here, this does not pose a problem because it has little effect on the overall height of the electronic device.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to the drawings.

First, a first embodiment of the present invention will be described.

In FIG. 1, 1 is a main board (circuit board) made of a printed circuit board, 2 is an integrated circuit element (hereinafter referred to as IC), and 3
Reference numeral 4 indicates a chip-type electronic component, 4 indicates an electronic component with leads, and 5 indicates a sub-board, which is made of a printed circuit board, etc., and is formed to have approximately the same area as the IC 2.

6 is a chip type electronic component.

To explain the mounting order, first, the electrodes 7 of the electronic component 6 are connected and fixed on the sub-board 5 by soldering 8 or the like. Among the external electrodes of the IC 2, the external electrode 9, which connects only to the electronic component 6 that is not connected to other circuits, is bent upward on the opposite side from the external electrode 10, which connects to the electronic components 3 and 4 on the main board 1. Keep it independent (separated). This external electrode 9 is inserted into a hole 11 formed in the sub-board 5, and is connected to the electronic component 6 on the sub-board 5 by soldering 8. The other external electrodes 10 are inserted into holes 12 formed in the main substrate 1. Next, chip type electronic parts 3
is adhered to the main board 1 with an adhesive 13, and at the same time, the leads 15 of the electronic component 4 with leads are inserted into the holes 16 formed in the main board 1.

After that, the external terminal 10 of the IC 2 and the electrode 14 of the electronic component 3 are connected.
, IJ-1-15 of the electronic component 4 are connected to the main board 1 by soldering 8, respectively.

According to the first embodiment, the electronic components 6 that should originally be mounted on the main board 1 can be connected within the surface area of the IC 20 via the sub-board 5 only by the independent electrodes 9 of the IC 2. 5 and the main board 1 is not necessary, and the external electrodes of a general IC can be used as they are. Therefore, the area of the substrate 1 can be reduced at low cost. Further, since a part of the external electrodes of the IC 2, that is, the independent external electrodes 9, are no longer inserted into the main board 1, there is ample space on the wiring surface of the main board 1, making it easier to route the wiring.

In addition, since the IC 2 and the electronic component 6 are connected as one component and have a standardized module structure, design and production can be rationalized. Furthermore, since the electronic component 6 is placed outside, its replacement becomes easy.

Next, a second embodiment of the present invention will be described.

In this embodiment, as shown in FIG. The short external electrode 9 is formed shorter than the electrode 10 on the sub-substrate 5.
It is inserted into the hole 11 formed in . This external electrode 9 is connected to the electronic component 6 connected on the sub-board 5 by soldering 8. Next, connect the long external electrode 10 of IC2 to the main substrate 1.
The second embodiment is inserted through a hole 12 formed in the second embodiment and connected by soldering 8, and the other configurations are the same as those of the first embodiment. The sub-board 5 may be placed upside down with respect to the electronic component 6, or may be attached below the main board.

Note that the main board 1 and the sub-board 5 may be made of any material other than printed circuit boards, such as ceramics and metals, and not only single-sided patterns, but also double-sided, multilayer, and other circuit boards can be applied. Moreover, all kinds of electronic components can be applied.

Also, IC2 is a Puer Inline Package (DIP).
It can be applied to all types of packaging. Furthermore, any thickness ζ, size, and connection method of the sub-board 5 can be applied. Furthermore, the electronic component 6 can be directly connected to the external electrical panel 9 without using the sub-board 5.

Effects of the Invention As described above, according to the present invention, a part of the external electrode of an integrated circuit element is connected only to an electronic component that is not connected to other circuits,
Since the remaining external electrodes of the integrated circuit element are connected to the circuit board, some of the peripheral electronic components of the integrated circuit element can be accommodated within the area of the integrated circuit element by using the external electrodes of the integrated circuit element as they are. It is possible to achieve high-density mounting of electronic components at low cost, and it is also possible to reduce the circuit board area and miniaturize electronic devices, etc. Also, there is plenty of circuit board area below the integrated circuit element. This allows for easy wiring.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the mounting method in the first embodiment of the present invention, FIG. 2 is a cross-sectional view showing the second embodiment of the present invention, and FIG.
The figure shows a conventional mounting method; it is a sectional view.

Claims (1)

[Claims] A method for high-density mounting of electronic components, characterized in that a part of the external electrodes of the integrated circuit element are connected only to electronic components that are not connected to other circuits, and the remaining external electrodes of the integrated circuit element are connected to a circuit board.