JPH0590728A - Hybrid integrated circuit board - Google Patents

Abstract

PURPOSE:To obtain a hybrid integrated circuit board which can be miniaturized, had improved high-frequency characteristics, and further enables other printed circuit boards such as a mother printed circuit board to be connected to be highly dense and inexpensive. CONSTITUTION:The title item is provided with a printed circuit board main body 11 where a circuit pattern is formed and chip-shaped electric parts 13 which also play a role of a external connection terminal mounted after being connected to a circuit pattern on the printed circuit board main body 11.

Description

Detailed Description of the Invention

[0001]

This invention relates to hybrid integrated circuit boards.

[0002]

2. Description of the Related Art In a conventional hybrid integrated circuit board, a plurality of lead frames are attached so as to be electrically connected to a through hole of another board such as a mother board or to be held by the board. Known attachment forms of the lead frame of such a hybrid integrated circuit board include DIP (dual inline package), SIP (single inline package), and ZIP (zigzag inline package). In the DIP type hybrid integrated circuit board, for example, an electronic component 2 such as a resistor or an IC chip is mounted on a board body 1 on which a circuit pattern is formed as shown in FIG. A plurality of lead frames 3 are attached side by side in parallel with each other.

According to the hybrid integrated circuit board, as shown in FIG. 6, the lead frame 3 is inserted into the through hole 5 of the mother board 4 and soldered or the like so that the hybrid integrated circuit is formed on the mother board 4. It can be fixed while the substrate is electrically connected.

However, in the above-mentioned conventional hybrid integrated circuit board, there is a problem that the end portion of the board body becomes a dead space for mounting the lead frame, which hinders miniaturization. Further, when a high-frequency current is passed, the lead frame acts as an unnecessary inductance in the circuit design and causes resonance, which deteriorates the high-frequency characteristics.

Further, in the above-mentioned conventional hybrid integrated circuit board, it is necessary to form a through hole in another board when connecting to another board such as a mother board. For this reason, there is a problem that the wiring space of the other substrate is limited, the densification is hindered, and the degree of freedom in wiring design is reduced.
There is also a problem that the cost of processing other substrates is increased because the through holes are formed.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art, and can be miniaturized, has excellent high-frequency characteristics, and has a high density of other substrates to be connected, and An object of the present invention is to provide a hybrid integrated circuit board capable of realizing cost reduction.

[0007]

According to the present invention, there is provided a board main body on which a circuit pattern is formed, and a chip-shaped electric body which is mounted on the board main body by being electrically connected to the circuit pattern and also serving as an external connection terminal. A hybrid integrated circuit board comprising: a component.

The electric parts are formed of a conductive material such as a metal such as iron, copper, or brass. Examples of the shape include a polygonal column shape, a column shape, a polygonal pyramid shape, a conical shape, and the like. The electric component may have a function as an external connection terminal, and may also be made to function as a resistor or an inductance incorporated in the circuit design by selecting the material and shape thereof. Further, from the viewpoint of improving solderability and adhesiveness with other substrates, it is desirable that the side surface of the electric component has a slit reaching the soldering surface (or the adhering surface).

As a method of mounting the electric component on the substrate body, the electric component is soldered to a conductive portion such as a land on the substrate body by reflow soldering or the like, or is adhered using a conductive adhesive. There is a method.

[0010]

According to the present invention, by providing a chip-shaped electric component which is also electrically connected to the circuit pattern and mounted on the substrate body and also functions as an external connection terminal, miniaturization and high frequency can be achieved. It is possible to obtain a hybrid integrated circuit board which has excellent characteristics and can realize high density and low cost of other boards to be connected.

That is, the electric component of the hybrid integrated circuit board is arranged on a conductive portion such as a land on another board, and soldering such as reflow soldering or bonding using a conductive adhesive is performed. Thus, the hybrid integrated circuit board can be fixed while being electrically connected to another board.

Therefore, the space for the end portion of the substrate body to which the lead frame is mounted is unnecessary, so that the size can be reduced, and the lead length of the electric component is short, which leads to a circuit design.
Since it can be suppressed from acting as unnecessary inductance, high frequency characteristics can be improved. Further, since the through hole is not formed in the other integrated substrate when connecting the hybrid integrated circuit substrate and the other substrate, the ratio of the wiring space of the other substrate is widened to increase the density and the flexibility of wiring design is increased. be able to. In addition, it is possible to reduce the processing cost for forming through holes on another substrate.

[0013]

The present invention will be described in detail below with reference to the drawings. Example 1

FIG. 1 is a perspective view showing a hybrid integrated circuit board of the first embodiment. That is, reference numeral 11 in the drawing is a substrate body on which a circuit pattern is formed. On the substrate body 11,
A plurality of quadrangular prismatic chip leads 12 which are electric parts that also serve as external connection terminals are mounted together with electronic parts 13 such as resistors and IC chips. The chip lead 12 is higher than the electronic component 13.

According to the hybrid integrated circuit board having such a structure, as shown in FIG. 2, the chip leads 12 are respectively overlapped with the lands 15 on the mother board 14 and are connected by soldering or the like. The hybrid integrated circuit board can be mounted on the mother board 14.

Therefore, the space at the end of the substrate body 11 to which the lead frame is mounted is unnecessary, so that the hybrid integrated circuit substrate itself can be miniaturized, and since the lead length of the chip lead 12 is short, it becomes an unnecessary inductance in the circuit design. Since it can be suppressed from acting, high frequency characteristics can be improved.

Further, since the through holes are not formed in the mother substrate 14, the ratio of the wiring space of the mother substrate 14 can be widened to increase the density, and the flexibility of the wiring design can be increased, and the processing for forming the through holes can be performed. Cost can be reduced. Furthermore, since the connection point between the two substrates by the chip lead 12 can be set appropriately, the degree of freedom in wiring design can be further increased. It is also possible to mount the hybrid integrated circuit boards on both surfaces of the mother board 14 or to stack a plurality of hybrid integrated circuit boards. Example 2

FIG. 3 is a perspective view showing a hybrid integrated circuit board of the second embodiment. That is, reference numeral 21 in the drawing is a substrate body on which a circuit pattern is formed. A plurality of electronic components 22 such as resistors and IC chips are mounted on one surface of the substrate body 21. On the other surface of the substrate body 21, a plurality of square columnar chip leads 23, which are electric components also serving as external connection terminals, are mounted in a DIP form (a form arranged in parallel at both ends).

According to the hybrid integrated circuit board having such a structure, as shown in FIG. 4, the external connection terminal sides of the chip leads 23 are respectively overlapped with the lands 25 on the mother board 24 and soldered or the like. By connecting, the hybrid integrated circuit board can be mounted on the mother board 24.

Therefore, the space at the end of the substrate main body 21 to which the lead frame is mounted is unnecessary, so that the hybrid integrated circuit substrate itself can be miniaturized, and since the lead length of the chip lead 23 is short, it becomes an unnecessary inductance in the circuit design. Since it can be suppressed from acting, high frequency characteristics can be improved.

Further, since the through holes are not formed in the mother substrate 24, the ratio of the wiring space of the mother substrate 24 can be widened to increase the density, and the degree of freedom in the wiring design can be increased, and the processing for forming the through holes can be performed. Cost can be reduced. In the above hybrid integrated circuit board, the chip lead 23 is attached to the board main body 21 in the DIP form, but it may be attached in other forms such as SIP and ZIP.

[0022]

As described above in detail, according to the present invention, it is possible to miniaturize, it has excellent high frequency characteristics, and it is possible to realize high density and low cost of other substrates to be connected. An integrated circuit board can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing a hybrid integrated circuit board according to a first embodiment.

FIG. 2 is a perspective view showing a connection state between the hybrid integrated circuit board and the mother board according to the first embodiment.

FIG. 3 is a perspective view showing a hybrid integrated circuit board according to a second embodiment.

FIG. 4 is a perspective view showing a connection state between a hybrid integrated circuit board and a mother board according to a second embodiment.

FIG. 5 is a perspective view showing a conventional hybrid integrated circuit board.

FIG. 6 is a perspective view showing a connection state between a conventional hybrid integrated circuit board and a mother board.

[Explanation of symbols]

11, 21 ... Substrate body, 12, 23 ... Chip-shaped electric parts (chip leads) that also serve as external connection terminals, 14, 2
4 ... Mother board.

Claims (1)

[Claims] 1. A substrate body on which a circuit pattern is formed,
A hybrid integrated circuit board, comprising: a chip-shaped electric component which is also electrically connected to the circuit pattern and mounted on the board body, and which also serves as an external connection terminal.