JPH10321757A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce an electronic circuit packaging area, to improve integration and to simplify the structure of a module by packaging an IC on a substrate which has a packaging area approximately equal to an IC packaging area, includes capacitors, a coil and a resistor constituted in the inside, and has external electrodes on its side surfaces. SOLUTION: A ceramic multilayered substrate 21 has a packaging area approximately equal to an IC 3, and includes capacitors 22 and 23, coil 24 and a resistor 25 as peripheral parts of the IC 3, formed by a lamination technique. Pads 31 to 35 for packaging the IC 3 are formed on an upper surface 21a of the substrate 21, and external electrodes 36 and 37 are formed on side surfaces 21b and 21c of the substrate 21, connecting the pads 31 to 35 to the IC 3 via a solder. By this arrangement, as the peripheral parts are included in the ceramic multilayered substrate, the electronic-circuit packaging area can be reduced, the integration of the electronic circuit can be improved, and the structure of the module can be simplified. Accordingly, the productivity is improved, and a low pricing and resource-saving module is realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic circuit module using a ceramic multilayer substrate.

[0002]

2. Description of the Related Art As a conventional electronic circuit module, for example, as shown in FIG. 5, a metal wiring 2 is formed on a surface of a substrate 1 and an IC (integrated circuit component) 3 is formed on the metal wiring 2.
And its peripheral components, ie, capacitors 4 to 7, a resistor 8,
9, a configuration in which coils 10 to 13 are mounted in a plane is known.

As another example of an electronic circuit module, an integrated circuit package having a plurality of integrated circuit chips mounted on a substrate has been proposed. For example, as disclosed in Japanese Patent Application Laid-Open No. 57-201098, a plurality of pins or pads are mounted on a ceramic laminated wiring board, and an organic polymer package is mounted on these pins or pads. An insulating layer is arranged, and a plurality of IC chips (integrated circuit chips) are mounted on the organic polymer insulating layer with the external connection wiring portion facing upward.

[0004]

The first problem of the conventional electronic circuit module is that various parts are mounted on a substrate in a planar manner, so that even if the electronic circuit is modularized, the mounting area is reduced. That is, it does not result in reduction. Conventionally, miniaturized components have been used to reduce the mounting area. However, since peripheral components are required, there is a limit in reducing the mounting area, and it is difficult to cope with the miniaturization.

A second problem is that the peripheral parts are composed of a ceramic material, a metal wiring and a metal electrode, and further, in order to connect the peripheral parts to the substrate, a metal connection is formed on the substrate. Since the pads are provided and the peripheral components and the connection pads are connected by solder, the overall weight becomes heavy and it is difficult to reduce the weight.

A third problem is that when an IC is mounted in a package, the mounting area is still large because the package is larger than an IC chip.

The present invention has been made in view of the above circumstances, and has a small mounting area, is lightweight and highly reliable, has an improved degree of integration of electronic circuits, and has a simple module configuration. It is an object of the present invention to provide an electronic circuit module capable of improving productivity, lowering costs, and saving resources.

[0008]

In order to solve the above problems, the present invention employs the following electronic circuit module.
That is, the electronic circuit module according to the first aspect of the present invention has a circuit configured by an integrated circuit component and a plurality of peripheral components. The integrated circuit component has a mounting area substantially equal to the mounting area of the integrated circuit component. In addition, a plurality of the peripheral components are formed in a circuit and mounted on a ceramic multilayer substrate having external electrodes provided on side surfaces.

According to a second aspect of the present invention, in the electronic circuit module, the integrated circuit component is mounted on the ceramic multi-layer substrate via one of a pad and a bump.

According to a third aspect of the present invention, in the electronic circuit module, the integrated circuit component is mounted on the ceramic multilayer substrate as a chip.

In the electronic circuit module according to the first or second aspect, the integrated circuit component has a mounting area substantially equal to the mounting area of the integrated circuit component, and a plurality of the peripheral components are formed therein. At the same time, by mounting on a ceramic multilayer substrate with external electrodes on the side, peripheral components will be taken into the ceramic multilayer substrate,
The mounting area of the electronic circuit is reduced. Further, the degree of integration of the electronic circuit is improved, and the configuration of the module is simplified. As a result, productivity is improved, cost is reduced, and resources can be saved.

Further, the reliability of the electronic circuit module is improved by using the ceramic multilayer substrate. The reason is that, in the conventional technology, a ceramic component is formed on a substrate by using a lamination technology or a printing technology, and further, a peripheral component on which an electrode is formed is mounted, and the electrode of the peripheral component is formed on the substrate. Although the reliability was poor because the connection pads were solder-connected, the invention according to claim 1 or 2 uses the ceramic multilayer substrate to eliminate the above-described electrodes, pads, and solder. This is because the conductors are connected in series and the reliability of the conductors themselves is improved.

Further, the circuit configuration of a plurality of peripheral components inside the ceramic multilayer substrate makes it possible to reduce the weight of the electronic circuit module. The reason is that in the prior art, the integrated circuit component, the substrate, the ceramic body which is the structure of the peripheral component, the metal pattern and the metal electrode which determines the electrical characteristics, and the solder which connects the peripheral component and the substrate are constituted. However, this is because the invention according to claim 1 or 2 does not require solder for connecting the ceramic body, metal electrodes, peripheral components, and the substrate.

In the electronic circuit module according to the third aspect,
By mounting the integrated circuit component on the ceramic multilayer substrate as a chip, bonding connection becomes possible, and further reduction in size and weight can be achieved.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the electronic circuit module of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 is a perspective view showing an electronic circuit module according to a first embodiment of the present invention.
Reference numeral 1 denotes a ceramic multilayer substrate (hereinafter, simply referred to as a substrate) on which an IC (integrated circuit component) 3 is mounted.

The substrate 21 has a mounting area substantially equal to the mounting area of the IC 3, and has a plurality of peripheral components formed therein and external electrodes provided on the side surfaces.

FIG. 2 is an enlarged sectional view of the substrate 21.
Capacitors 22, 23, a coil 24, and a resistor 25, which are peripheral components of the IC 3, are formed inside the substrate 21 by a lamination technique, and a pad 3 for mounting the IC 3 on the upper surface 21a is formed.
1 to 35 are formed, while the side surface 21 b of the substrate 21 is formed.
External electrodes 36 and 37 are formed on 21c. The pads 31 to 35 are connected to the IC 3 via solder.

As described above, according to the electronic circuit module of the present embodiment, the IC 3 has a mounting area substantially equal to the mounting area of the IC 3, and includes the capacitors 22 and 23, which are peripheral components, and the coil inside. Since the circuit 24 and the resistor 25 are configured and mounted on the substrate 21 provided with the external electrodes 36 and 37 on the side surfaces, the mounting area of the electronic circuit can be reduced, and the integration degree of the electronic circuit can be improved. Therefore, the configuration of the module can be simplified. Therefore, productivity can be improved, and cost reduction and resource saving can be achieved.

Further, since the substrate 21 is used,
The conductors inside are connected in series, the reliability of the conductor itself is improved, and the reliability of the electronic circuit module is improved. In addition, since the capacitors 22, 23, the coil 24, and the resistor 25, which are peripheral components, are formed in the circuit board 21, the weight of the electronic circuit module can be reduced.

(Second Embodiment) FIG. 3 is a side view showing an electronic circuit module according to a second embodiment of the present invention. A ceramic multilayer substrate having bumps 42 and 43 formed on the upper surface 41a instead of pads on the upper surface 41a. The IC 41 is mounted on the bumps 42 and 43 of the substrate 41 using the IC 41. In this electronic circuit module, the same effects as those of the electronic circuit module of the first embodiment can be obtained.

(Third Embodiment) FIG. 4 is a side view showing an electronic circuit module according to a third embodiment of the present invention, and uses a ceramic multilayer substrate 51 having no upper surface 51a provided with pads. The IC 3 is mounted on the upper surface 51 a of the chip 51 by a chip, and the substrate 51 and the IC 3 are bonded 52, 53.
Are connected by. In this electronic circuit module, pads and solder are not used, so that downsizing and weight reduction can be achieved.

The size can be further reduced by mounting a bare chip (integrated circuit component) on the ceramic multilayer substrate 51 by bonding. In addition, as a chip mounting, an IC package mounted (CS
A variety of options are available, such as a P package (including a P package) or a bare chip bonded and connected.

[0023]

As described above, according to the electronic circuit module of the present invention, the integrated circuit component has a mounting area substantially equal to the mounting area of the integrated circuit component. Since a plurality of the peripheral components are formed in a circuit and mounted on a ceramic multilayer substrate provided with external electrodes on the side surfaces, the peripheral components are taken into the ceramic multilayer substrate, and the mounting area of the electronic circuit is reduced. can do. Further, the degree of integration of the electronic circuit is improved, and the configuration of the module can be simplified. Therefore, productivity can be improved, and cost reduction and resource saving can be achieved.

Further, since a ceramic multilayer substrate is used,
The reliability of the electronic circuit module can be improved,
Further, since a plurality of peripheral components are formed in a circuit inside the ceramic multilayer substrate, the weight of the electronic circuit module can be reduced.

According to the electronic circuit module of the present invention, since the integrated circuit component is mounted on the ceramic multilayer substrate as a chip, it can be bonded and connected, and the size and weight can be further reduced. .

[Brief description of the drawings]

FIG. 1 is a perspective view showing an electronic circuit module according to a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a ceramic multilayer substrate of the electronic circuit module according to the first embodiment of the present invention.

FIG. 3 is a side view showing an electronic circuit module according to a second embodiment of the present invention.

FIG. 4 is a side view showing an electronic circuit module according to a third embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional electronic circuit module.

[Explanation of symbols]

 Reference Signs List 3 IC (integrated circuit component) 21 Ceramic multilayer substrate 21a Upper surface 21b, 21c Side surface 22, 23 Capacitor (peripheral component) 24 Coil (peripheral component) 25 Resistance (peripheral component) 31-35 Pad 36, 37 External electrode 41 Ceramic multilayer substrate 41a Upper surface 42, 43 Bump 51 Ceramic multilayer substrate 51a Upper surface 52, 53 Bonding

Claims (3)

[Claims] 1. An electronic circuit module comprising a circuit configured by an integrated circuit component and a plurality of peripheral components, wherein the integrated circuit component has a mounting area substantially equal to a mounting area of the integrated circuit component. ,
An electronic circuit module, wherein a plurality of the peripheral components are formed in a circuit and mounted on a ceramic multilayer substrate provided with external electrodes on side surfaces. 2. The electronic circuit module according to claim 1, wherein the integrated circuit component is mounted on the ceramic multilayer substrate via one of a pad and a bump. 3. The integrated circuit component is mounted on the ceramic multilayer substrate as a chip.
An electronic circuit module as described in the above.