JPS6362104B2 - - Google Patents

Info

Publication number
JPS6362104B2
JPS6362104B2 JP57120903A JP12090382A JPS6362104B2 JP S6362104 B2 JPS6362104 B2 JP S6362104B2 JP 57120903 A JP57120903 A JP 57120903A JP 12090382 A JP12090382 A JP 12090382A JP S6362104 B2 JPS6362104 B2 JP S6362104B2
Authority
JP
Japan
Prior art keywords
insulating film
wiring
communication hole
metal wiring
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57120903A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5911647A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12090382A priority Critical patent/JPS5911647A/ja
Publication of JPS5911647A publication Critical patent/JPS5911647A/ja
Publication of JPS6362104B2 publication Critical patent/JPS6362104B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP12090382A 1982-07-12 1982-07-12 半導体装置の製造方法 Granted JPS5911647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12090382A JPS5911647A (ja) 1982-07-12 1982-07-12 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12090382A JPS5911647A (ja) 1982-07-12 1982-07-12 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5911647A JPS5911647A (ja) 1984-01-21
JPS6362104B2 true JPS6362104B2 (en, 2012) 1988-12-01

Family

ID=14797844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12090382A Granted JPS5911647A (ja) 1982-07-12 1982-07-12 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5911647A (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62146224A (ja) * 1985-12-20 1987-06-30 Kobe Steel Ltd 強度のばらつきの少ない高靭性高張力高炭素鋼線材の製造方法
JPH03116852A (ja) * 1989-09-29 1991-05-17 Nec Corp 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100748A (en) * 1980-12-15 1982-06-23 Toshiba Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS5911647A (ja) 1984-01-21

Similar Documents

Publication Publication Date Title
JPH0779106B2 (ja) 半導体集積回路の製造方法
US5937326A (en) Method for making semiconductor device having via hole
JP2720023B2 (ja) 半導体装置の製造方法
JPS6362104B2 (en, 2012)
JPH02253628A (ja) 半導体装置の製造方法
JP2000195867A (ja) 象嵌技法を利用した微細金属パタ―ン形成方法
JPH0435047A (ja) 半導体装置の多層配線形成方法
KR0138008B1 (ko) 금속배선층 형성방법
JPS6379347A (ja) 半導体装置の製造方法
JP3323264B2 (ja) 半導体装置の製造方法
JPS6161545B2 (en, 2012)
JP3036038B2 (ja) 半導体装置の製造方法
JP2783898B2 (ja) 半導体装置の製造方法
JPH0587973B2 (en, 2012)
JPH0786209A (ja) 半導体装置の製造方法
JPH0461360A (ja) 半導体装置の多層配線形成方法
JPS6059742B2 (ja) 半導体装置およびその製造方法
KR0148326B1 (ko) 반도체 소자의 제조방법
JP3329148B2 (ja) 配線形成方法
JPS6130418B2 (en, 2012)
JPS60154539A (ja) アルミ配線の形成方法
JPH0794481A (ja) 半導体装置の製造方法
JPS6262469B2 (en, 2012)
JPS6226843A (ja) 電極金属配線パタ−ンの形成方法
JPH0344931A (ja) 半導体集積回路装置の製造方法