JPS6361779B2 - - Google Patents

Info

Publication number
JPS6361779B2
JPS6361779B2 JP21079883A JP21079883A JPS6361779B2 JP S6361779 B2 JPS6361779 B2 JP S6361779B2 JP 21079883 A JP21079883 A JP 21079883A JP 21079883 A JP21079883 A JP 21079883A JP S6361779 B2 JPS6361779 B2 JP S6361779B2
Authority
JP
Japan
Prior art keywords
heat sink
resin
case
hard resin
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21079883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60103649A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58210798A priority Critical patent/JPS60103649A/ja
Publication of JPS60103649A publication Critical patent/JPS60103649A/ja
Publication of JPS6361779B2 publication Critical patent/JPS6361779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/114—
    • H10W40/10—
    • H10W72/07551—
    • H10W72/50—
    • H10W74/00—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58210798A 1983-11-11 1983-11-11 半導体装置 Granted JPS60103649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58210798A JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58210798A JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS60103649A JPS60103649A (ja) 1985-06-07
JPS6361779B2 true JPS6361779B2 (cg-RX-API-DMAC10.html) 1988-11-30

Family

ID=16595304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58210798A Granted JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS60103649A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
JP2973792B2 (ja) * 1993-09-21 1999-11-08 富士電機株式会社 樹脂封止形半導体装置

Also Published As

Publication number Publication date
JPS60103649A (ja) 1985-06-07

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