JPS6361101U - - Google Patents
Info
- Publication number
- JPS6361101U JPS6361101U JP15598186U JP15598186U JPS6361101U JP S6361101 U JPS6361101 U JP S6361101U JP 15598186 U JP15598186 U JP 15598186U JP 15598186 U JP15598186 U JP 15598186U JP S6361101 U JPS6361101 U JP S6361101U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- plating layer
- resin
- electrical characteristics
- solder plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
Description
第１Ａ図は本考案の実施例としてサーミスタを
示す正面図、第１Ｂ図はその側面図、第２図は第
１Ａ図の一部拡大断面図、第３Ａ図は従来例に係
る電子部品の正面図、第３Ｂ図はその側面図、第
４Ａ図は従来例に係る電子部品にデイツプ半田付
けを施す前を示す一部拡大断面図、第４Ｂ図は従
来例に係る電子部品にデイツプ半田付けを施した
後の状態を示す一部拡大断面図である。
１１……サーミスタ半導体（特定の性質を有す
る材料）、１１ａ……電極、１２ａ，１２ｂ……
リード線、１３……樹脂モールド、１５……半田
メツキ層。
Fig. 1A is a front view showing a thermistor as an embodiment of the present invention, Fig. 1B is a side view thereof, Fig. 2 is a partially enlarged sectional view of Fig. 1A, and Fig. 3A is a front view of an electronic component according to a conventional example. Fig. 3B is a side view thereof, Fig. 4A is a partially enlarged sectional view showing the conventional electronic component before dip soldering, and Fig. 4B is a conventional electronic component after dip soldering. It is a partially enlarged sectional view showing the state after application. 11... Thermistor semiconductor (material with specific properties), 11a... Electrode, 12a, 12b...
Lead wire, 13...resin mold, 15...solder plating layer.
Claims (1)
た電極に対して、表面に半田メツキ層を有するリ
ード線が半田付けされており且つ、材料と電極と
リード線の一部が樹脂により被覆されている電子
部品において、前記リード線の一部は半田メツキ
層が除去されており、この除去された部分に前記
樹脂が密着していることを特徴とする電子部品。 (2) 一定の電気的特性を有する材料は半導体で
ある実用新案登録請求の範囲第１項記載の電子部
品。[Claims for Utility Model Registration] (1) A lead wire having a solder plating layer on the surface is soldered to an electrode provided on a material having certain electrical characteristics, and the material, the electrode, and the lead An electronic component in which a part of the wire is covered with a resin, wherein the solder plating layer is removed from a part of the lead wire, and the resin is in close contact with the removed part. parts. (2) The electronic component according to claim 1, wherein the material having certain electrical characteristics is a semiconductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15598186U JPS6361101U (en) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15598186U JPS6361101U (en) | 1986-10-09 | 1986-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361101U true JPS6361101U (en) | 1988-04-22 |
Family
ID=31077170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15598186U Pending JPS6361101U (en) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361101U (en) |
-
1986
- 1986-10-09 JP JP15598186U patent/JPS6361101U/ja active Pending
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