JPS6358395B2 - - Google Patents

Info

Publication number

JPS6358395B2

JPS6358395B2 JP56076239A JP7623981A JPS6358395B2 JP S6358395 B2 JPS6358395 B2 JP S6358395B2 JP 56076239 A JP56076239 A JP 56076239A JP 7623981 A JP7623981 A JP 7623981A JP S6358395 B2 JPS6358395 B2 JP S6358395B2

Authority

JP

Japan

Prior art keywords

wiring circuit

metal plate

plastic film

component insertion

adhesive

Prior art date

1981-05-19

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 238000005530 etching Methods 0.000 claims description 13
• 238000003780 insertion Methods 0.000 claims description 10
• 230000037431 insertion Effects 0.000 claims description 10
• 238000004519 manufacturing process Methods 0.000 claims description 9
• 239000002184 metal Substances 0.000 claims description 7
• 229910052751 metal Inorganic materials 0.000 claims description 7
• 239000002985 plastic film Substances 0.000 claims description 7
• 229920006255 plastic film Polymers 0.000 claims description 7
• 239000000853 adhesive Substances 0.000 claims description 5
• 230000001070 adhesive effect Effects 0.000 claims description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
• 229910052802 copper Inorganic materials 0.000 description 15
• 239000010949 copper Substances 0.000 description 15
• 239000004020 conductor Substances 0.000 description 12
• 229920001721 polyimide Polymers 0.000 description 9
• 238000000034 method Methods 0.000 description 4
• RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
• 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
• 239000004642 Polyimide Substances 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
• KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• 238000004891 communication Methods 0.000 description 1
• 238000005260 corrosion Methods 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 238000003754 machining Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 210000000056 organ Anatomy 0.000 description 1
• 229920006267 polyester film Polymers 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1

Cited By (1)