JPS6357745U - - Google Patents
Info
- Publication number
- JPS6357745U JPS6357745U JP15101186U JP15101186U JPS6357745U JP S6357745 U JPS6357745 U JP S6357745U JP 15101186 U JP15101186 U JP 15101186U JP 15101186 U JP15101186 U JP 15101186U JP S6357745 U JPS6357745 U JP S6357745U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- card
- probe card
- needles
- rows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は、本考案の一実施例を縦断面で切断し
た状態で示す斜視図、第２図および第３図は第１
図に示すプローブ針３，４の配置を示すための模
式的な平面図であり、それぞれボンデイング・パ
ツト５，６が２重に配置されている場合と、千鳥
状に配置されている場合である。
１…第１のプローブ・カード、２…第２のプロ
ーブ・カード、３，４…プローブ針、５…内側ボ
ンデイング・パツト、６…外側ボンデイング・パ
ツト、７…チツプ、８…テスター接続端子、９…
絶縁緩衝材。
FIG. 1 is a perspective view showing one embodiment of the present invention cut in longitudinal section, and FIGS.
FIG. 4 is a schematic plan view showing the arrangement of the probe needles 3 and 4 shown in the figure, in which the bonding pads 5 and 6 are arranged in a double manner and in a staggered manner, respectively. . DESCRIPTION OF SYMBOLS 1...First probe card, 2...Second probe card, 3, 4...Probe needle, 5...Inner bonding pad, 6...Outer bonding pad, 7...Tip, 8...Tester connection terminal, 9 …
Insulated cushioning material.
Claims (1)
られたパツトに対応してプローブ針を２列に並べ
て設けたことを特徴とするプローブ・カード。 (2) それぞれがプローブ針を１列に並べた第１
および第２のプローブ・カードを有し、この第１
および第２のプローブ・カードが脱着可能である
実用新案登録請求の範囲第１項記載のプローブ・
カード。[Claims for Utility Model Registration] (1) A probe card characterized in that probe needles are arranged in two rows corresponding to the parts arranged in two rows around a semiconductor integrated circuit chip. (2) Each has a first line of probe needles arranged in a row.
and a second probe card;
and the probe according to claim 1, wherein the second probe card is removable.
card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15101186U JPS6357745U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15101186U JPS6357745U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357745U true JPS6357745U (en) | 1988-04-18 |
Family
ID=31067679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15101186U Pending JPS6357745U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002082528A1 (en) * | 2001-04-04 | 2002-10-17 | Fujitsu Limited | Contactor device for semiconductor device and method of testing semiconductor device |
-
1986
- 1986-09-30 JP JP15101186U patent/JPS6357745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002082528A1 (en) * | 2001-04-04 | 2002-10-17 | Fujitsu Limited | Contactor device for semiconductor device and method of testing semiconductor device |