JPH0459945U - - Google Patents
Info
- Publication number
- JPH0459945U JPH0459945U JP10218390U JP10218390U JPH0459945U JP H0459945 U JPH0459945 U JP H0459945U JP 10218390 U JP10218390 U JP 10218390U JP 10218390 U JP10218390 U JP 10218390U JP H0459945 U JPH0459945 U JP H0459945U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- test element
- integrated circuit
- incorporated
- function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は、本考案による半導体チツプの一実施
例を示す平面図、第２図は、本考案による他の実
施例を示す平面図、第３図は、本考案によるさら
に他の実施例を示す平面図、第４図は、従来の半
導体チツプの一例を示す平面図である。
１……チツプ、２……集積回路部（単体の集積
回路構成素子）、３……パツド部、４……ＴＥＧ
部（被試験用テストエレメント部）。
FIG. 1 is a plan view showing one embodiment of a semiconductor chip according to the present invention, FIG. 2 is a plan view showing another embodiment according to the present invention, and FIG. 3 is a plan view showing still another embodiment according to the present invention. FIG. 4 is a plan view showing an example of a conventional semiconductor chip. 1... Chip, 2... Integrated circuit section (single integrated circuit component), 3... Pad section, 4... TEG
section (test element section for test).
Claims (1)
において、 集積回路としての機能を有する集積回路部と、
被試験用テストエレメント部とが形成されている
ことを特徴とする半導体チツプ。 (2) 単一パツケージに組込まれる半導体チツプ
において、 複数の被試験用テストエレメント部が形成され
ていることを特徴とする半導体チツプ。 (3) 被試験用テストエレメント部が、集積回路
としての機能の一部を有するものであることを特
徴とする請求項１または２に記載の半導体チツプ
。 (4) 被試験用テストエレメント部が、複数部分
に分散して設けられた同一種類のエレメントから
なることを特徴とする請求項１または２に記載の
半導体チツプ。[Scope of Claim for Utility Model Registration] (1) In a semiconductor chip incorporated into a single package, an integrated circuit portion having a function as an integrated circuit;
A semiconductor chip characterized in that a test element section for being tested is formed. (2) A semiconductor chip that is incorporated into a single package and is characterized in that a plurality of test element sections for testing are formed. (3) The semiconductor chip according to claim 1 or 2, wherein the test element section under test has a part of the function of an integrated circuit. (4) The semiconductor chip according to claim 1 or 2, wherein the test element part to be tested consists of elements of the same type distributed over a plurality of parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218390U JPH0459945U (en) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218390U JPH0459945U (en) | 1990-10-01 | 1990-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459945U true JPH0459945U (en) | 1992-05-22 |
Family
ID=31846213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10218390U Pending JPH0459945U (en) | 1990-10-01 | 1990-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459945U (en) |
-
1990
- 1990-10-01 JP JP10218390U patent/JPH0459945U/ja active Pending