JPS6255350U - - Google Patents
Info
- Publication number
- JPS6255350U JPS6255350U JP14760185U JP14760185U JPS6255350U JP S6255350 U JPS6255350 U JP S6255350U JP 14760185 U JP14760185 U JP 14760185U JP 14760185 U JP14760185 U JP 14760185U JP S6255350 U JPS6255350 U JP S6255350U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- test
- area
- semiconductor integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Description
第１図は本考案のウエハーの一部を上から見た
図である。
１……集積回路、２……スクライブ線、３……
ボンデイングパツト、４……試験用パツド、５…
…コンデンサ、６……本チツプ、７……試験用チ
ツプ。
FIG. 1 is a top view of a portion of the wafer of the present invention. 1... integrated circuit, 2... scribe line, 3...
Bonding pad, 4...Test pad, 5...
...Capacitor, 6...This chip, 7...Test chip.
Claims (1)
、個々の集積回路チツプの周囲に試験用領域を設
け、該領域内に個々の集積回路チツプのボンデイ
ング用パツドから引き出した配線に接続された試
験用パツドと、該試験用パツドに片端が接続され
もう一端が接地されたコンデンサとを有したこと
を特徴とする半導体集積回路装置。 In a semiconductor integrated circuit device, a test area is provided around each integrated circuit chip during wafer manufacturing, and a test pad is connected to wiring drawn out from a bonding pad of each integrated circuit chip within the area; A semiconductor integrated circuit device comprising a capacitor having one end connected to the test pad and the other end grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14760185U JPS6255350U (en) | 1985-09-26 | 1985-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14760185U JPS6255350U (en) | 1985-09-26 | 1985-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255350U true JPS6255350U (en) | 1987-04-06 |
Family
ID=31061109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14760185U Pending JPS6255350U (en) | 1985-09-26 | 1985-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255350U (en) |
-
1985
- 1985-09-26 JP JP14760185U patent/JPS6255350U/ja active Pending