JPS6355537U - - Google Patents
Info
- Publication number
- JPS6355537U JPS6355537U JP1986149414U JP14941486U JPS6355537U JP S6355537 U JPS6355537 U JP S6355537U JP 1986149414 U JP1986149414 U JP 1986149414U JP 14941486 U JP14941486 U JP 14941486U JP S6355537 U JPS6355537 U JP S6355537U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bonding pad
- integrated circuit
- semiconductor elements
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
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- H10W46/301—
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- H10W72/07141—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/07554—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/5445—
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- H10W72/547—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986149414U JPS6355537U (enExample) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986149414U JPS6355537U (enExample) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355537U true JPS6355537U (enExample) | 1988-04-14 |
Family
ID=31064599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986149414U Pending JPS6355537U (enExample) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355537U (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189580A (ja) * | 1999-01-08 | 2001-07-10 | Aisin Aw Co Ltd | 電子部品 |
| JP2002134642A (ja) * | 2000-10-20 | 2002-05-10 | Keihin Corp | ワイヤボンディング端子構造 |
| JP2002134643A (ja) * | 2000-10-20 | 2002-05-10 | Keihin Corp | ワイヤボンディング端子構造 |
| JP2013070260A (ja) * | 2011-09-22 | 2013-04-18 | Nippon Dempa Kogyo Co Ltd | 弾性表面波素子及びその製造方法 |
| JP2014027585A (ja) * | 2012-07-30 | 2014-02-06 | Seiko Epson Corp | 電子部品の製造方法および電子モジュールの製造方法 |
| WO2019215806A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 配線部材及びこれを備えた半導体モジュール |
-
1986
- 1986-09-29 JP JP1986149414U patent/JPS6355537U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189580A (ja) * | 1999-01-08 | 2001-07-10 | Aisin Aw Co Ltd | 電子部品 |
| JP2006140535A (ja) * | 1999-01-08 | 2006-06-01 | Aisin Aw Co Ltd | 電子部品 |
| JP2002134642A (ja) * | 2000-10-20 | 2002-05-10 | Keihin Corp | ワイヤボンディング端子構造 |
| JP2002134643A (ja) * | 2000-10-20 | 2002-05-10 | Keihin Corp | ワイヤボンディング端子構造 |
| JP2013070260A (ja) * | 2011-09-22 | 2013-04-18 | Nippon Dempa Kogyo Co Ltd | 弾性表面波素子及びその製造方法 |
| JP2014027585A (ja) * | 2012-07-30 | 2014-02-06 | Seiko Epson Corp | 電子部品の製造方法および電子モジュールの製造方法 |
| WO2019215806A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 配線部材及びこれを備えた半導体モジュール |
| JPWO2019215806A1 (ja) * | 2018-05-08 | 2021-02-12 | 三菱電機株式会社 | 配線部材及びこれを備えた半導体モジュール |
| US11476224B2 (en) | 2018-05-08 | 2022-10-18 | Mitsubishi Electric Corporation | Wiring member and semiconductor module including same |