JPH0353842U - - Google Patents

Info

Publication number
JPH0353842U
JPH0353842U JP1989115546U JP11554689U JPH0353842U JP H0353842 U JPH0353842 U JP H0353842U JP 1989115546 U JP1989115546 U JP 1989115546U JP 11554689 U JP11554689 U JP 11554689U JP H0353842 U JPH0353842 U JP H0353842U
Authority
JP
Japan
Prior art keywords
pad
semiconductor device
element part
wiring
starting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115546U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115546U priority Critical patent/JPH0353842U/ja
Publication of JPH0353842U publication Critical patent/JPH0353842U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP1989115546U 1989-09-29 1989-09-29 Pending JPH0353842U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115546U JPH0353842U (enExample) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115546U JPH0353842U (enExample) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353842U true JPH0353842U (enExample) 1991-05-24

Family

ID=31663873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115546U Pending JPH0353842U (enExample) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353842U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181354A (ja) * 1987-01-22 1988-07-26 New Japan Radio Co Ltd 半導体装置
JPH0287525A (ja) * 1988-09-22 1990-03-28 Nec Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181354A (ja) * 1987-01-22 1988-07-26 New Japan Radio Co Ltd 半導体装置
JPH0287525A (ja) * 1988-09-22 1990-03-28 Nec Corp 半導体装置

Similar Documents

Publication Publication Date Title
JPH0353842U (enExample)
JPS6355537U (enExample)
JPS62190342U (enExample)
JPH0421872U (enExample)
JPH0247039U (enExample)
JPS62163962U (enExample)
JPS6413126U (enExample)
JPS62122359U (enExample)
JPS62163939U (enExample)
JPS6240844U (enExample)
JPS6249239U (enExample)
JPH0474463U (enExample)
JPS63147831U (enExample)
JPH0252452U (enExample)
JPS6364051U (enExample)
JPS6387838U (enExample)
JPS63157936U (enExample)
JPH0313754U (enExample)
JPS63106132U (enExample)
JPS6312835U (enExample)
JPH0165148U (enExample)
JPH0247034U (enExample)
JPS62171014U (enExample)
JPS63180928U (enExample)
JPS62116563U (enExample)