JPH0353842U - - Google Patents

Info

Publication number
JPH0353842U
JPH0353842U JP1989115546U JP11554689U JPH0353842U JP H0353842 U JPH0353842 U JP H0353842U JP 1989115546 U JP1989115546 U JP 1989115546U JP 11554689 U JP11554689 U JP 11554689U JP H0353842 U JPH0353842 U JP H0353842U
Authority
JP
Japan
Prior art keywords
pad
semiconductor device
element part
wiring
starting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989115546U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989115546U priority Critical patent/JPH0353842U/ja
Publication of JPH0353842U publication Critical patent/JPH0353842U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案の一実施例に係る半導体装置
の部分平面図、第２図は、ボンデイングパツドの
構造を示す半導体装置の部分縦断面図、第３図は
、測定用パツドの構造を示す半導体装置の部分縦
断面図、第４図は、従来例を示す半導体装置の部
分平面図、第５図は、同じく従来例を示す半導体
装置の部分平面図である。 １ａ……測定用パツド、１ｂ……ボンデイング
パツド、５……配線路。 FIG. 1 is a partial plan view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a partial vertical sectional view of the semiconductor device showing the structure of a bonding pad, and FIG. 3 is a structure of a measurement pad. FIG. 4 is a partial plan view of a semiconductor device showing a conventional example, and FIG. 5 is a partial plan view of a semiconductor device also showing a conventional example. 1a...Measurement pad, 1b...Bonding pad, 5...Wiring path.

Claims (1)

【実用新案登録請求の範囲】 パツドとこのパツドに接続された配線路とを介
して素子部が外部に接続される半導体装置におい
て、 素子部側の起点からパツドに至る配線路が２経
路以上設けられたことを特徴とする半導体装置。[Scope of claim for utility model registration] In a semiconductor device in which an element part is connected to the outside via a pad and a wiring path connected to this pad, two or more wiring paths are provided from a starting point on the element part side to the pad. A semiconductor device characterized by:
JP1989115546U 1989-09-29 1989-09-29 Pending JPH0353842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989115546U JPH0353842U (en) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989115546U JPH0353842U (en) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353842U true JPH0353842U (en) 1991-05-24

Family

ID=31663873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989115546U Pending JPH0353842U (en) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353842U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181354A (en) * 1987-01-22 1988-07-26 New Japan Radio Co Ltd Semiconductor device
JPH0287525A (en) * 1988-09-22 1990-03-28 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63181354A (en) * 1987-01-22 1988-07-26 New Japan Radio Co Ltd Semiconductor device
JPH0287525A (en) * 1988-09-22 1990-03-28 Nec Corp Semiconductor device

Similar Documents

Publication Publication Date Title
JPH0353842U (en)
JPS6355537U (en)
JPS62190342U (en)
JPH0421872U (en)
JPH0247039U (en)
JPS62163962U (en)
JPS6413126U (en)
JPS62122359U (en)
JPS62163939U (en)
JPH0165148U (en)
JPS6240844U (en)
JPS6249239U (en)
JPH0474463U (en)
JPS63147831U (en)
JPH0252452U (en)
JPS6364051U (en)
JPS6387838U (en)
JPS63157936U (en)
JPH0313754U (en)
JPS63106132U (en)
JPS6312835U (en)
JPH0247034U (en)
JPS62171014U (en)
JPS62116563U (en)
JPS6221550U (en)