JPH0421872U - - Google Patents
Info
- Publication number
- JPH0421872U JPH0421872U JP6092790U JP6092790U JPH0421872U JP H0421872 U JPH0421872 U JP H0421872U JP 6092790 U JP6092790 U JP 6092790U JP 6092790 U JP6092790 U JP 6092790U JP H0421872 U JPH0421872 U JP H0421872U
- Authority
- JP
- Japan
- Prior art keywords
- acceleration sensor
- chips
- sensor body
- circuit
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001133 acceleration Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Pressure Sensors (AREA)
Description
第１図は本考案によりなる加速度センサの実施
例を示した平面説明図、第２図は第１図における
Ａ−Ａ線断面図、第３図は加速度センサの平面説
明図、第４図はその断面図、第５図はその電気的
回路図、第６図は従来例の説明図である。
２０……センサ本体、２１，２２……ハウジン
グ、２３……枠体、２４……錘り、２５……ビー
ム部、２６……ストツパー。
FIG. 1 is an explanatory plan view showing an embodiment of the acceleration sensor according to the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. 1, FIG. 3 is an explanatory plan view of the acceleration sensor, and FIG. FIG. 5 is a sectional view thereof, FIG. 5 is an electrical circuit diagram thereof, and FIG. 6 is an explanatory diagram of a conventional example. 20... Sensor body, 21, 22... Housing, 23... Frame, 24... Weight, 25... Beam section, 26... Stopper.
Claims (1)
アンプ等の１乃至複数のチツプ４と共に半導体ピ
エゾ抵抗使用の加速度センサ本体２０を固定し、
上記各チツプ４及びセンサ本体２０と前記回路２
とを同一太さの金線を使用してボンデイング接続
されているものであることを特徴とする加速度セ
ンサ。 On a ceramic substrate on which a circuit 2 is formed, an acceleration sensor body 20 using a semiconductor piezoresistor is fixed together with one or more chips 4 such as an operational amplifier,
Each of the above-mentioned chips 4, the sensor body 20 and the above-mentioned circuit 2
An acceleration sensor characterized in that the and are connected by bonding using a gold wire of the same thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6092790U JPH0421872U (en) | 1990-06-08 | 1990-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6092790U JPH0421872U (en) | 1990-06-08 | 1990-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0421872U true JPH0421872U (en) | 1992-02-24 |
Family
ID=31588724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6092790U Pending JPH0421872U (en) | 1990-06-08 | 1990-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421872U (en) |
-
1990
- 1990-06-08 JP JP6092790U patent/JPH0421872U/ja active Pending