JPS6240844U - - Google Patents
Info
- Publication number
- JPS6240844U JPS6240844U JP1985132660U JP13266085U JPS6240844U JP S6240844 U JPS6240844 U JP S6240844U JP 1985132660 U JP1985132660 U JP 1985132660U JP 13266085 U JP13266085 U JP 13266085U JP S6240844 U JPS6240844 U JP S6240844U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- integrated circuit
- connection structure
- conducting conduction
- opposite sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Description
第１図は、本考案の実施例を示す圧電発振器の
斜視図である。第２図は、第１図の圧電発振器の
平面図である。
１５……チツプ、１６……ボンデイングパツト
。
FIG. 1 is a perspective view of a piezoelectric oscillator showing an embodiment of the present invention. FIG. 2 is a plan view of the piezoelectric oscillator of FIG. 1. 15...chip, 16...bonding patch.
Claims (1)
イングパツトを設けたことを特徴とする集積回路
の接続構造。 (2) 前記チツプ内で導通のみを行なうためのボ
ンデイングパツトが該チツプの対向する方向の辺
に沿つて配置したことを特徴とする実用新案登録
請求の範囲第１項記載の集積回路の接続構造。[Claims for Utility Model Registration] (1) A connection structure for an integrated circuit characterized by providing a bonding pad for only conducting conduction within a chip. (2) The integrated circuit connection structure according to claim 1, wherein bonding pads for only conducting conduction within the chip are arranged along opposite sides of the chip. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985132660U JPS6240844U (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985132660U JPS6240844U (en) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240844U true JPS6240844U (en) | 1987-03-11 |
Family
ID=31032255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985132660U Pending JPS6240844U (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240844U (en) |
-
1985
- 1985-08-29 JP JP1985132660U patent/JPS6240844U/ja active Pending