JPS635227Y2 - - Google Patents
Info
- Publication number
- JPS635227Y2 JPS635227Y2 JP1982101872U JP10187282U JPS635227Y2 JP S635227 Y2 JPS635227 Y2 JP S635227Y2 JP 1982101872 U JP1982101872 U JP 1982101872U JP 10187282 U JP10187282 U JP 10187282U JP S635227 Y2 JPS635227 Y2 JP S635227Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin material
- plunger
- upper mold
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 30
- 238000000465 moulding Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10187282U JPS5887337U (ja) | 1982-07-05 | 1982-07-05 | 半導体樹脂封入成形用金型装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10187282U JPS5887337U (ja) | 1982-07-05 | 1982-07-05 | 半導体樹脂封入成形用金型装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5887337U JPS5887337U (ja) | 1983-06-14 |
JPS635227Y2 true JPS635227Y2 (US07655688-20100202-C00086.png) | 1988-02-12 |
Family
ID=29896530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10187282U Granted JPS5887337U (ja) | 1982-07-05 | 1982-07-05 | 半導体樹脂封入成形用金型装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5887337U (US07655688-20100202-C00086.png) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57123222U (US07655688-20100202-C00086.png) * | 1981-01-26 | 1982-07-31 |
-
1982
- 1982-07-05 JP JP10187282U patent/JPS5887337U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5611236A (en) * | 1979-07-10 | 1981-02-04 | Towa Seimitsu Kogyo Kk | Method and metallic mold for plastic molding |
JPS5630841A (en) * | 1979-08-24 | 1981-03-28 | Towa Seimitsu Kogyo Kk | Plastic molding method and metallic mold therefor |
Also Published As
Publication number | Publication date |
---|---|
JPS5887337U (ja) | 1983-06-14 |