JPS6352112B2 - - Google Patents

Info

Publication number
JPS6352112B2
JPS6352112B2 JP58135458A JP13545883A JPS6352112B2 JP S6352112 B2 JPS6352112 B2 JP S6352112B2 JP 58135458 A JP58135458 A JP 58135458A JP 13545883 A JP13545883 A JP 13545883A JP S6352112 B2 JPS6352112 B2 JP S6352112B2
Authority
JP
Japan
Prior art keywords
parts
weight
electroless plating
resist ink
solid solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58135458A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6026669A (ja
Inventor
Nobuo Uozu
Satoshi Isoda
Hiroyoshi Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi Condenser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Condenser Co Ltd filed Critical Hitachi Condenser Co Ltd
Priority to JP58135458A priority Critical patent/JPS6026669A/ja
Publication of JPS6026669A publication Critical patent/JPS6026669A/ja
Publication of JPS6352112B2 publication Critical patent/JPS6352112B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58135458A 1983-07-25 1983-07-25 無電解めつき用レジストインク Granted JPS6026669A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58135458A JPS6026669A (ja) 1983-07-25 1983-07-25 無電解めつき用レジストインク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58135458A JPS6026669A (ja) 1983-07-25 1983-07-25 無電解めつき用レジストインク

Publications (2)

Publication Number Publication Date
JPS6026669A JPS6026669A (ja) 1985-02-09
JPS6352112B2 true JPS6352112B2 (enExample) 1988-10-18

Family

ID=15152179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58135458A Granted JPS6026669A (ja) 1983-07-25 1983-07-25 無電解めつき用レジストインク

Country Status (1)

Country Link
JP (1) JPS6026669A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999020090A1 (en) * 1997-10-14 1999-04-22 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025253517A1 (ja) * 2024-06-04 2025-12-11 三井化学Ictマテリア株式会社 電子装置の製造方法
WO2025253514A1 (ja) * 2024-06-04 2025-12-11 三井化学Ictマテリア株式会社 粘着性フィルム及び電子装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5790072A (en) * 1980-11-25 1982-06-04 Hitachi Ltd Resist ink composition for chemical plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999020090A1 (en) * 1997-10-14 1999-04-22 Ibiden Co., Ltd. Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole

Also Published As

Publication number Publication date
JPS6026669A (ja) 1985-02-09

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