JPS6352109B2 - - Google Patents

Info

Publication number
JPS6352109B2
JPS6352109B2 JP21001685A JP21001685A JPS6352109B2 JP S6352109 B2 JPS6352109 B2 JP S6352109B2 JP 21001685 A JP21001685 A JP 21001685A JP 21001685 A JP21001685 A JP 21001685A JP S6352109 B2 JPS6352109 B2 JP S6352109B2
Authority
JP
Japan
Prior art keywords
sample
film
target
film formation
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21001685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6270568A (ja
Inventor
Motohiko Kitsukai
Yoshifumi Ogawa
Hiroshi Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP21001685A priority Critical patent/JPS6270568A/ja
Publication of JPS6270568A publication Critical patent/JPS6270568A/ja
Publication of JPS6352109B2 publication Critical patent/JPS6352109B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP21001685A 1985-09-25 1985-09-25 スパツタ方法 Granted JPS6270568A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21001685A JPS6270568A (ja) 1985-09-25 1985-09-25 スパツタ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21001685A JPS6270568A (ja) 1985-09-25 1985-09-25 スパツタ方法

Publications (2)

Publication Number Publication Date
JPS6270568A JPS6270568A (ja) 1987-04-01
JPS6352109B2 true JPS6352109B2 (enExample) 1988-10-18

Family

ID=16582428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21001685A Granted JPS6270568A (ja) 1985-09-25 1985-09-25 スパツタ方法

Country Status (1)

Country Link
JP (1) JPS6270568A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01270321A (ja) * 1988-04-22 1989-10-27 Anelva Corp スパッタリング装置
JPH10147864A (ja) 1996-11-20 1998-06-02 Nec Corp 薄膜形成方法及びスパッタ装置
JP2007262445A (ja) * 2006-03-27 2007-10-11 Shin Meiwa Ind Co Ltd 基材保持装置
EP2437280A1 (en) * 2010-09-30 2012-04-04 Applied Materials, Inc. Systems and methods for forming a layer of sputtered material
JP5836485B2 (ja) * 2012-06-29 2015-12-24 キヤノンアネルバ株式会社 スパッタリング装置およびスパッタリング方法
CN113388820B (zh) * 2021-08-16 2021-11-09 陛通半导体设备(苏州)有限公司 改善填充膜均匀性的基座装置、溅射设备及溅射工艺

Also Published As

Publication number Publication date
JPS6270568A (ja) 1987-04-01

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