JPS6351541B2 - - Google Patents

Info

Publication number
JPS6351541B2
JPS6351541B2 JP57148545A JP14854582A JPS6351541B2 JP S6351541 B2 JPS6351541 B2 JP S6351541B2 JP 57148545 A JP57148545 A JP 57148545A JP 14854582 A JP14854582 A JP 14854582A JP S6351541 B2 JPS6351541 B2 JP S6351541B2
Authority
JP
Japan
Prior art keywords
plate
shaped portion
rod
lead wire
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57148545A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5939055A (ja
Inventor
Shigemi Ono
Shigeo Shimada
Shinichiro Kawabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP57148545A priority Critical patent/JPS5939055A/ja
Publication of JPS5939055A publication Critical patent/JPS5939055A/ja
Publication of JPS6351541B2 publication Critical patent/JPS6351541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W72/30—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H10W72/073—
    • H10W72/07651—
    • H10W72/352—
    • H10W72/60—

Landscapes

  • Wire Bonding (AREA)
JP57148545A 1982-08-26 1982-08-26 半導体装置の製造方法 Granted JPS5939055A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57148545A JPS5939055A (ja) 1982-08-26 1982-08-26 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57148545A JPS5939055A (ja) 1982-08-26 1982-08-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5939055A JPS5939055A (ja) 1984-03-03
JPS6351541B2 true JPS6351541B2 (cg-RX-API-DMAC10.html) 1988-10-14

Family

ID=15455157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57148545A Granted JPS5939055A (ja) 1982-08-26 1982-08-26 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5939055A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2510708B2 (ja) * 1988-12-02 1996-06-26 ローム株式会社 半導体装置
JPH09289404A (ja) 1996-04-24 1997-11-04 Honda Motor Co Ltd リボンとボンディングワイヤとマイクロ波回路用パッケージ
JP2012244132A (ja) * 2011-05-24 2012-12-10 Hitachi Ltd 半導体装置
CN108010753A (zh) * 2017-12-29 2018-05-08 无锡赛晶电力电容器有限公司 一种电容器引出线连接结构及其制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4216568Y1 (cg-RX-API-DMAC10.html) * 1965-06-01 1967-09-25

Also Published As

Publication number Publication date
JPS5939055A (ja) 1984-03-03

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