JPS6350849Y2 - - Google Patents
Info
- Publication number
- JPS6350849Y2 JPS6350849Y2 JP1982113666U JP11366682U JPS6350849Y2 JP S6350849 Y2 JPS6350849 Y2 JP S6350849Y2 JP 1982113666 U JP1982113666 U JP 1982113666U JP 11366682 U JP11366682 U JP 11366682U JP S6350849 Y2 JPS6350849 Y2 JP S6350849Y2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- adhesive
- base film
- tape material
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- 239000003086 colorant Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 239000002759 woven fabric Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982113666U JPS5918431U (ja) | 1982-07-26 | 1982-07-26 | 集積回路製造用キャリアテ−プ材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982113666U JPS5918431U (ja) | 1982-07-26 | 1982-07-26 | 集積回路製造用キャリアテ−プ材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918431U JPS5918431U (ja) | 1984-02-04 |
| JPS6350849Y2 true JPS6350849Y2 (enExample) | 1988-12-27 |
Family
ID=30263034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982113666U Granted JPS5918431U (ja) | 1982-07-26 | 1982-07-26 | 集積回路製造用キャリアテ−プ材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918431U (enExample) |
-
1982
- 1982-07-26 JP JP1982113666U patent/JPS5918431U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5918431U (ja) | 1984-02-04 |
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