JPS5918431U - 集積回路製造用キャリアテ−プ材 - Google Patents

集積回路製造用キャリアテ−プ材

Info

Publication number
JPS5918431U
JPS5918431U JP1982113666U JP11366682U JPS5918431U JP S5918431 U JPS5918431 U JP S5918431U JP 1982113666 U JP1982113666 U JP 1982113666U JP 11366682 U JP11366682 U JP 11366682U JP S5918431 U JPS5918431 U JP S5918431U
Authority
JP
Japan
Prior art keywords
integrated circuit
carrier tape
tape material
circuit manufacturing
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982113666U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6350849Y2 (enExample
Inventor
一郎 大澤
宮本　真佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikkan Industries Co Ltd
Original Assignee
Nikkan Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikkan Industries Co Ltd filed Critical Nikkan Industries Co Ltd
Priority to JP1982113666U priority Critical patent/JPS5918431U/ja
Publication of JPS5918431U publication Critical patent/JPS5918431U/ja
Application granted granted Critical
Publication of JPS6350849Y2 publication Critical patent/JPS6350849Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1982113666U 1982-07-26 1982-07-26 集積回路製造用キャリアテ−プ材 Granted JPS5918431U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982113666U JPS5918431U (ja) 1982-07-26 1982-07-26 集積回路製造用キャリアテ−プ材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982113666U JPS5918431U (ja) 1982-07-26 1982-07-26 集積回路製造用キャリアテ−プ材

Publications (2)

Publication Number Publication Date
JPS5918431U true JPS5918431U (ja) 1984-02-04
JPS6350849Y2 JPS6350849Y2 (enExample) 1988-12-27

Family

ID=30263034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982113666U Granted JPS5918431U (ja) 1982-07-26 1982-07-26 集積回路製造用キャリアテ−プ材

Country Status (1)

Country Link
JP (1) JPS5918431U (enExample)

Also Published As

Publication number Publication date
JPS6350849Y2 (enExample) 1988-12-27

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