JPS6349920B2 - - Google Patents
Info
- Publication number
- JPS6349920B2 JPS6349920B2 JP56113030A JP11303081A JPS6349920B2 JP S6349920 B2 JPS6349920 B2 JP S6349920B2 JP 56113030 A JP56113030 A JP 56113030A JP 11303081 A JP11303081 A JP 11303081A JP S6349920 B2 JPS6349920 B2 JP S6349920B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- powder
- circuit board
- adhesive layer
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11303081A JPS5815290A (ja) | 1981-07-21 | 1981-07-21 | 混成集積回路用基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11303081A JPS5815290A (ja) | 1981-07-21 | 1981-07-21 | 混成集積回路用基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815290A JPS5815290A (ja) | 1983-01-28 |
| JPS6349920B2 true JPS6349920B2 (enrdf_load_stackoverflow) | 1988-10-06 |
Family
ID=14601685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11303081A Granted JPS5815290A (ja) | 1981-07-21 | 1981-07-21 | 混成集積回路用基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815290A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6450592A (en) * | 1987-08-21 | 1989-02-27 | Shinko Chem | Super-heat dissipation type composite circuit board |
| TW201211123A (en) | 2010-03-24 | 2012-03-16 | Sumitomo Chemical Co | Liquid composition and metal base circuit substrate |
| JP5487010B2 (ja) | 2010-05-27 | 2014-05-07 | 日本発條株式会社 | 回路基板用積層板及び金属ベース回路基板 |
-
1981
- 1981-07-21 JP JP11303081A patent/JPS5815290A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5815290A (ja) | 1983-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8007897B2 (en) | Insulating sheet and method for producing it, and power module comprising the insulating sheet | |
| US20060188727A1 (en) | Thermally conductive resin sheet and power module using the same | |
| CN110088895B (zh) | 散热基材、散热电路结构体及其制造方法 | |
| KR101523144B1 (ko) | 방열특성이 개선된 에폭시 복합수지 조성물 및 이를 이용한 방열 구조물 | |
| JP4994743B2 (ja) | フィルム状接着剤及びそれを使用する半導体パッケージの製造方法 | |
| US20010021547A1 (en) | Bonding materials | |
| TW201335260A (zh) | 樹脂硬化物與半硬化樹脂膜及其製造方法、樹脂組合物 | |
| JPWO2009008471A1 (ja) | 誘電層付銅箔 | |
| KR20040030588A (ko) | 열경화성 접착제 필름 및 그것을 사용한 접착 구조물 | |
| CN107709502A (zh) | 散热材料粘接用组合物、带粘接剂的散热材料、嵌入基板和其制造方法 | |
| JP5424984B2 (ja) | 半導体モジュールの製造方法 | |
| JP4053744B2 (ja) | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着シート | |
| JP5274007B2 (ja) | 熱伝導性樹脂シートおよびこれを用いたパワーモジュール | |
| JP2001288244A (ja) | 熱硬化性樹脂組成物、その製法及びそれを用いた製品 | |
| JP3599149B2 (ja) | 導電ペースト、導電ペーストを用いた電気回路及び電気回路の製造法 | |
| WO2018099095A1 (zh) | 一种硅烷改性石墨烯油墨及其制备方法 | |
| KR20240017803A (ko) | 수지 시트, 적층체, 및 반도체 장치 | |
| JP4273399B2 (ja) | 導電ペースト及びその製造方法 | |
| JPS6349920B2 (enrdf_load_stackoverflow) | ||
| JP2000290613A (ja) | 熱硬化性接着シート | |
| WO2021149690A1 (ja) | 熱伝導性シート、積層体、及び半導体装置 | |
| JPS605589A (ja) | 高熱伝導性金属ベ−スプリント基板 | |
| JPH118450A (ja) | 金属ベース回路基板 | |
| JPH0575225A (ja) | 金属ベース印刷配線基板及びその製造方法 | |
| JP2015026780A (ja) | 絶縁放熱基板 |