JPS6349901B2 - - Google Patents

Info

Publication number
JPS6349901B2
JPS6349901B2 JP56047473A JP4747381A JPS6349901B2 JP S6349901 B2 JPS6349901 B2 JP S6349901B2 JP 56047473 A JP56047473 A JP 56047473A JP 4747381 A JP4747381 A JP 4747381A JP S6349901 B2 JPS6349901 B2 JP S6349901B2
Authority
JP
Japan
Prior art keywords
wiring
film
plasma
metal
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56047473A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57162449A (en
Inventor
Moritaka Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4747381A priority Critical patent/JPS57162449A/ja
Publication of JPS57162449A publication Critical patent/JPS57162449A/ja
Publication of JPS6349901B2 publication Critical patent/JPS6349901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP4747381A 1981-03-31 1981-03-31 Formation of multilayer wiring Granted JPS57162449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4747381A JPS57162449A (en) 1981-03-31 1981-03-31 Formation of multilayer wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4747381A JPS57162449A (en) 1981-03-31 1981-03-31 Formation of multilayer wiring

Publications (2)

Publication Number Publication Date
JPS57162449A JPS57162449A (en) 1982-10-06
JPS6349901B2 true JPS6349901B2 (enrdf_load_stackoverflow) 1988-10-06

Family

ID=12776106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4747381A Granted JPS57162449A (en) 1981-03-31 1981-03-31 Formation of multilayer wiring

Country Status (1)

Country Link
JP (1) JPS57162449A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165345A (ja) * 1986-01-16 1987-07-21 Fuji Electric Co Ltd 半導体装置の電極配線形成方法
JP2616062B2 (ja) * 1989-11-13 1997-06-04 日本電気株式会社 コンタクト孔埋め込み方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3881971A (en) * 1972-11-29 1975-05-06 Ibm Method for fabricating aluminum interconnection metallurgy system for silicon devices

Also Published As

Publication number Publication date
JPS57162449A (en) 1982-10-06

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